2011 Aluminum vs. Solder Alloy 601
2011 aluminum belongs to the aluminum alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown. Please note that the two materials have significantly dissimilar densities. This means that additional care is required when interpreting the data, because some material properties are based on units of mass, while others are based on units of area or volume.
For each property being compared, the top bar is 2011 aluminum and the bottom bar is solder alloy 601.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 71 | |
| 31 |
| Elongation at Break, % | 8.5 to 18 | |
| 83 |
| Poisson's Ratio | 0.33 | |
| 0.41 |
| Shear Modulus, GPa | 27 | |
| 11 |
| Tensile Strength: Ultimate (UTS), MPa | 310 to 420 | |
| 12 |
Thermal Properties
| Latent Heat of Fusion, J/g | 390 | |
| 43 |
| Melting Completion (Liquidus), °C | 640 | |
| 120 |
| Melting Onset (Solidus), °C | 540 | |
| 120 |
| Specific Heat Capacity, J/kg-K | 870 | |
| 230 |
| Thermal Conductivity, W/m-K | 140 to 170 | |
| 34 |
| Thermal Expansion, µm/m-K | 23 | |
| 23 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 35 to 45 | |
| 12 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 100 to 130 | |
| 14 |
Otherwise Unclassified Properties
| Density, g/cm3 | 3.1 | |
| 7.3 |
| Embodied Water, L/kg | 1150 | |
| 1330 |
Common Calculations
| Stiffness to Weight: Axial, points | 13 | |
| 2.3 |
| Stiffness to Weight: Bending, points | 44 | |
| 14 |
| Strength to Weight: Axial, points | 27 to 37 | |
| 0.45 |
| Strength to Weight: Bending, points | 32 to 40 | |
| 1.6 |
| Thermal Diffusivity, mm2/s | 51 to 64 | |
| 20 |
| Thermal Shock Resistance, points | 14 to 19 | |
| 1.2 |
Alloy Composition
| Aluminum (Al), % | 91.3 to 94.6 | |
| 0 to 0.0010 |
| Antimony (Sb), % | 0 | |
| 0 to 0.1 |
| Arsenic (As), % | 0 | |
| 0 to 0.030 |
| Bismuth (Bi), % | 0.2 to 0.6 | |
| 0 to 0.1 |
| Cadmium (Cd), % | 0 | |
| 0 to 0.0020 |
| Copper (Cu), % | 5.0 to 6.0 | |
| 0 to 0.050 |
| Gold (Au), % | 0 | |
| 0 to 0.050 |
| Indium (In), % | 0 | |
| 51 to 52.5 |
| Iron (Fe), % | 0 to 0.7 | |
| 0 to 0.020 |
| Lead (Pb), % | 0.2 to 0.6 | |
| 0 to 0.070 |
| Nickel (Ni), % | 0 | |
| 0 to 0.010 |
| Silicon (Si), % | 0 to 0.4 | |
| 0 |
| Silver (Ag), % | 0 | |
| 0 to 0.1 |
| Tin (Sn), % | 0 | |
| 47.5 to 48.5 |
| Zinc (Zn), % | 0 to 0.3 | |
| 0 to 0.0010 |
| Residuals, % | 0 to 0.15 | |
| 0 |