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AISI 329 Stainless Steel vs. C96300 Copper-nickel

AISI 329 stainless steel belongs to the iron alloys classification, while C96300 copper-nickel belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is AISI 329 stainless steel and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 240
150
Elastic (Young's, Tensile) Modulus, GPa 200
130
Elongation at Break, % 17
11
Poisson's Ratio 0.27
0.33
Shear Modulus, GPa 80
49
Tensile Strength: Ultimate (UTS), MPa 710
580
Tensile Strength: Yield (Proof), MPa 540
430

Thermal Properties

Latent Heat of Fusion, J/g 300
230
Maximum Temperature: Mechanical, °C 1100
240
Melting Completion (Liquidus), °C 1440
1200
Melting Onset (Solidus), °C 1390
1150
Specific Heat Capacity, J/kg-K 480
400
Thermal Conductivity, W/m-K 16
37
Thermal Expansion, µm/m-K 13
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.0
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 2.4
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 16
42
Density, g/cm3 7.7
8.9
Embodied Carbon, kg CO2/kg material 3.1
5.1
Embodied Energy, MJ/kg 44
76
Embodied Water, L/kg 170
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 110
59
Resilience: Unit (Modulus of Resilience), kJ/m3 730
720
Stiffness to Weight: Axial, points 15
8.2
Stiffness to Weight: Bending, points 25
19
Strength to Weight: Axial, points 25
18
Strength to Weight: Bending, points 23
17
Thermal Diffusivity, mm2/s 4.3
10
Thermal Shock Resistance, points 19
20

Alloy Composition

Carbon (C), % 0 to 0.080
0 to 0.15
Chromium (Cr), % 23 to 28
0
Copper (Cu), % 0
72.3 to 80.8
Iron (Fe), % 63.1 to 74
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0 to 1.0
0.25 to 1.5
Molybdenum (Mo), % 1.0 to 2.0
0
Nickel (Ni), % 2.0 to 5.0
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0 to 0.040
0 to 0.020
Silicon (Si), % 0 to 0.75
0 to 0.5
Sulfur (S), % 0 to 0.030
0 to 0.020
Residuals, % 0
0 to 0.5