MakeItFrom.com
Menu (ESC)

ASTM A369 Grade FP9 vs. C17300 Copper

ASTM A369 grade FP9 belongs to the iron alloys classification, while C17300 copper belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is ASTM A369 grade FP9 and the bottom bar is C17300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
120
Elongation at Break, % 20
3.0 to 23
Poisson's Ratio 0.28
0.33
Shear Modulus, GPa 75
45
Shear Strength, MPa 300
320 to 790
Tensile Strength: Ultimate (UTS), MPa 470
500 to 1380
Tensile Strength: Yield (Proof), MPa 240
160 to 1200

Thermal Properties

Latent Heat of Fusion, J/g 270
230
Maximum Temperature: Mechanical, °C 600
270
Melting Completion (Liquidus), °C 1450
980
Melting Onset (Solidus), °C 1410
870
Specific Heat Capacity, J/kg-K 480
380
Thermal Conductivity, W/m-K 26
110
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
22
Electrical Conductivity: Equal Weight (Specific), % IACS 10
23

Otherwise Unclassified Properties

Density, g/cm3 7.8
8.8
Embodied Carbon, kg CO2/kg material 2.0
9.4
Embodied Energy, MJ/kg 28
150
Embodied Water, L/kg 87
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 80
40 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 140
110 to 5410
Stiffness to Weight: Axial, points 14
7.6
Stiffness to Weight: Bending, points 25
19
Strength to Weight: Axial, points 17
16 to 44
Strength to Weight: Bending, points 17
16 to 31
Thermal Diffusivity, mm2/s 6.9
32
Thermal Shock Resistance, points 13
17 to 48

Alloy Composition

Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
1.8 to 2.0
Carbon (C), % 0 to 0.15
0
Chromium (Cr), % 8.0 to 10
0
Copper (Cu), % 0
95.5 to 97.8
Iron (Fe), % 87.1 to 90.3
0 to 0.4
Lead (Pb), % 0
0.2 to 0.6
Manganese (Mn), % 0.3 to 0.6
0
Molybdenum (Mo), % 0.9 to 1.1
0
Nickel (Ni), % 0
0.2 to 0.6
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 0.5 to 1.0
0 to 0.2
Sulfur (S), % 0 to 0.030
0
Residuals, % 0
0 to 0.5