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ASTM A372 Grade K Steel vs. C19200 Copper

ASTM A372 grade K steel belongs to the iron alloys classification, while C19200 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is ASTM A372 grade K steel and the bottom bar is C19200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
120
Elongation at Break, % 23
2.0 to 35
Poisson's Ratio 0.29
0.34
Shear Modulus, GPa 73
44
Shear Strength, MPa 490
190 to 300
Tensile Strength: Ultimate (UTS), MPa 780
280 to 530
Tensile Strength: Yield (Proof), MPa 620
98 to 510

Thermal Properties

Latent Heat of Fusion, J/g 250
210
Maximum Temperature: Mechanical, °C 440
200
Melting Completion (Liquidus), °C 1460
1080
Melting Onset (Solidus), °C 1420
1080
Specific Heat Capacity, J/kg-K 470
390
Thermal Conductivity, W/m-K 48
240
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.8
58 to 74
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
58 to 75

Otherwise Unclassified Properties

Base Metal Price, % relative 4.4
30
Density, g/cm3 7.9
8.9
Embodied Carbon, kg CO2/kg material 1.8
2.6
Embodied Energy, MJ/kg 24
41
Embodied Water, L/kg 57
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 160
10 to 98
Resilience: Unit (Modulus of Resilience), kJ/m3 1010
42 to 1120
Stiffness to Weight: Axial, points 13
7.2
Stiffness to Weight: Bending, points 24
18
Strength to Weight: Axial, points 27
8.8 to 17
Strength to Weight: Bending, points 24
11 to 16
Thermal Diffusivity, mm2/s 13
69
Thermal Shock Resistance, points 23
10 to 19

Alloy Composition

Carbon (C), % 0 to 0.18
0
Chromium (Cr), % 1.0 to 1.8
0
Copper (Cu), % 0
98.5 to 99.19
Iron (Fe), % 93.4 to 96.6
0.8 to 1.2
Lead (Pb), % 0
0 to 0.030
Manganese (Mn), % 0.1 to 0.4
0
Molybdenum (Mo), % 0.2 to 0.6
0
Nickel (Ni), % 2.0 to 3.3
0
Phosphorus (P), % 0 to 0.015
0.010 to 0.040
Silicon (Si), % 0.15 to 0.35
0
Sulfur (S), % 0 to 0.010
0
Zinc (Zn), % 0
0 to 0.2
Residuals, % 0
0 to 0.2