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ASTM A372 Grade L Steel vs. C19000 Copper

ASTM A372 grade L steel belongs to the iron alloys classification, while C19000 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is ASTM A372 grade L steel and the bottom bar is C19000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
120
Elongation at Break, % 14
2.5 to 50
Poisson's Ratio 0.29
0.34
Shear Modulus, GPa 73
43
Shear Strength, MPa 700
170 to 390
Tensile Strength: Ultimate (UTS), MPa 1160
260 to 760
Tensile Strength: Yield (Proof), MPa 1040
140 to 630

Thermal Properties

Latent Heat of Fusion, J/g 250
210
Maximum Temperature: Mechanical, °C 430
200
Melting Completion (Liquidus), °C 1460
1080
Melting Onset (Solidus), °C 1420
1040
Specific Heat Capacity, J/kg-K 470
390
Thermal Conductivity, W/m-K 44
250
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.5
60
Electrical Conductivity: Equal Weight (Specific), % IACS 8.6
61

Otherwise Unclassified Properties

Base Metal Price, % relative 3.5
31
Density, g/cm3 7.8
8.9
Embodied Carbon, kg CO2/kg material 1.7
2.7
Embodied Energy, MJ/kg 22
42
Embodied Water, L/kg 54
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 150
18 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 2890
89 to 1730
Stiffness to Weight: Axial, points 13
7.2
Stiffness to Weight: Bending, points 24
18
Strength to Weight: Axial, points 41
8.2 to 24
Strength to Weight: Bending, points 31
10 to 21
Thermal Diffusivity, mm2/s 12
73
Thermal Shock Resistance, points 34
9.3 to 27

Alloy Composition

Carbon (C), % 0.38 to 0.43
0
Chromium (Cr), % 0.7 to 0.9
0
Copper (Cu), % 0
96.9 to 99
Iron (Fe), % 95.2 to 96.3
0 to 0.1
Lead (Pb), % 0
0 to 0.050
Manganese (Mn), % 0.6 to 0.8
0
Molybdenum (Mo), % 0.2 to 0.3
0
Nickel (Ni), % 1.7 to 2.0
0.9 to 1.3
Phosphorus (P), % 0 to 0.015
0.15 to 0.35
Silicon (Si), % 0.15 to 0.35
0
Sulfur (S), % 0 to 0.010
0
Zinc (Zn), % 0
0 to 0.8
Residuals, % 0
0 to 0.5