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ASTM A372 Grade L Steel vs. C72150 Copper-nickel

ASTM A372 grade L steel belongs to the iron alloys classification, while C72150 copper-nickel belongs to the copper alloys. There are 30 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is ASTM A372 grade L steel and the bottom bar is C72150 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 350
99
Elastic (Young's, Tensile) Modulus, GPa 190
150
Elongation at Break, % 14
29
Poisson's Ratio 0.29
0.33
Shear Modulus, GPa 73
55
Shear Strength, MPa 700
320
Tensile Strength: Ultimate (UTS), MPa 1160
490
Tensile Strength: Yield (Proof), MPa 1040
210

Thermal Properties

Latent Heat of Fusion, J/g 250
250
Maximum Temperature: Mechanical, °C 430
600
Melting Completion (Liquidus), °C 1460
1210
Melting Onset (Solidus), °C 1420
1250
Specific Heat Capacity, J/kg-K 470
410
Thermal Conductivity, W/m-K 44
22
Thermal Expansion, µm/m-K 13
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.5
3.5
Electrical Conductivity: Equal Weight (Specific), % IACS 8.6
3.6

Otherwise Unclassified Properties

Base Metal Price, % relative 3.5
45
Density, g/cm3 7.8
8.9
Embodied Carbon, kg CO2/kg material 1.7
6.1
Embodied Energy, MJ/kg 22
88
Embodied Water, L/kg 54
270

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 150
120
Resilience: Unit (Modulus of Resilience), kJ/m3 2890
150
Stiffness to Weight: Axial, points 13
9.1
Stiffness to Weight: Bending, points 24
20
Strength to Weight: Axial, points 41
15
Strength to Weight: Bending, points 31
15
Thermal Diffusivity, mm2/s 12
6.0
Thermal Shock Resistance, points 34
18

Alloy Composition

Carbon (C), % 0.38 to 0.43
0 to 0.1
Chromium (Cr), % 0.7 to 0.9
0
Copper (Cu), % 0
52.5 to 57
Iron (Fe), % 95.2 to 96.3
0 to 0.1
Lead (Pb), % 0
0 to 0.050
Manganese (Mn), % 0.6 to 0.8
0 to 0.050
Molybdenum (Mo), % 0.2 to 0.3
0
Nickel (Ni), % 1.7 to 2.0
43 to 46
Phosphorus (P), % 0 to 0.015
0
Silicon (Si), % 0.15 to 0.35
0 to 0.5
Sulfur (S), % 0 to 0.010
0
Zinc (Zn), % 0
0 to 0.2
Residuals, % 0
0 to 0.5