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ASTM A387 Grade 21 Steel vs. C82200 Copper

ASTM A387 grade 21 steel belongs to the iron alloys classification, while C82200 copper belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is ASTM A387 grade 21 steel and the bottom bar is C82200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
120
Elongation at Break, % 21
8.0 to 20
Poisson's Ratio 0.29
0.34
Shear Modulus, GPa 74
44
Tensile Strength: Ultimate (UTS), MPa 500 to 590
390 to 660
Tensile Strength: Yield (Proof), MPa 230 to 350
210 to 520

Thermal Properties

Latent Heat of Fusion, J/g 260
220
Maximum Temperature: Mechanical, °C 480
230
Melting Completion (Liquidus), °C 1470
1080
Melting Onset (Solidus), °C 1430
1040
Specific Heat Capacity, J/kg-K 470
390
Thermal Conductivity, W/m-K 41
180
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.6
45
Electrical Conductivity: Equal Weight (Specific), % IACS 8.8
46

Otherwise Unclassified Properties

Base Metal Price, % relative 4.1
55
Density, g/cm3 7.9
8.9
Embodied Carbon, kg CO2/kg material 1.8
4.8
Embodied Energy, MJ/kg 23
74
Embodied Water, L/kg 62
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84 to 110
49 to 66
Resilience: Unit (Modulus of Resilience), kJ/m3 140 to 320
180 to 1130
Stiffness to Weight: Axial, points 13
7.4
Stiffness to Weight: Bending, points 24
18
Strength to Weight: Axial, points 18 to 21
12 to 20
Strength to Weight: Bending, points 18 to 20
13 to 19
Thermal Diffusivity, mm2/s 11
53
Thermal Shock Resistance, points 14 to 17
14 to 23

Alloy Composition

Beryllium (Be), % 0
0.35 to 0.8
Carbon (C), % 0.050 to 0.15
0
Chromium (Cr), % 2.8 to 3.3
0
Cobalt (Co), % 0
0 to 0.3
Copper (Cu), % 0
97.4 to 98.7
Iron (Fe), % 94.4 to 96
0
Manganese (Mn), % 0.3 to 0.6
0
Molybdenum (Mo), % 0.9 to 1.1
0
Nickel (Ni), % 0
1.0 to 2.0
Phosphorus (P), % 0 to 0.025
0
Silicon (Si), % 0 to 0.5
0
Sulfur (S), % 0 to 0.025
0
Residuals, % 0
0 to 0.5