ASTM B477 Au-Ni-Ag vs. CC383H Copper-nickel
ASTM B477 Au-Ni-Ag belongs to the otherwise unclassified metals classification, while CC383H copper-nickel belongs to the copper alloys. There are 18 material properties with values for both materials. Properties with values for just one material (13, in this case) are not shown.
For each property being compared, the top bar is ASTM B477 Au-Ni-Ag and the bottom bar is CC383H copper-nickel.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 95 | |
140 |
Elongation at Break, % | 5.5 to 11 | |
20 |
Poisson's Ratio | 0.41 | |
0.33 |
Shear Modulus, GPa | 34 | |
52 |
Tensile Strength: Ultimate (UTS), MPa | 310 to 550 | |
490 |
Thermal Properties
Latent Heat of Fusion, J/g | 80 | |
240 |
Melting Completion (Liquidus), °C | 1010 | |
1180 |
Melting Onset (Solidus), °C | 930 | |
1130 |
Specific Heat Capacity, J/kg-K | 160 | |
410 |
Thermal Expansion, µm/m-K | 15 | |
15 |
Electrical Properties
Electrical Conductivity: Equal Volume, % IACS | 14 | |
5.2 |
Electrical Conductivity: Equal Weight (Specific), % IACS | 7.5 | |
5.3 |
Otherwise Unclassified Properties
Density, g/cm3 | 17 | |
8.9 |
Common Calculations
Stiffness to Weight: Axial, points | 3.1 | |
8.6 |
Stiffness to Weight: Bending, points | 8.9 | |
19 |
Strength to Weight: Axial, points | 5.0 to 9.0 | |
15 |
Strength to Weight: Bending, points | 6.0 to 8.8 | |
16 |
Thermal Shock Resistance, points | 16 to 28 | |
17 |
Alloy Composition
Aluminum (Al), % | 0 | |
0 to 0.010 |
Bismuth (Bi), % | 0 | |
0 to 0.010 |
Boron (B), % | 0 | |
0 to 0.010 |
Cadmium (Cd), % | 0 | |
0 to 0.020 |
Carbon (C), % | 0 | |
0 to 0.030 |
Copper (Cu), % | 0 | |
64 to 69.1 |
Gold (Au), % | 74.2 to 75.8 | |
0 |
Iron (Fe), % | 0 | |
0.5 to 1.5 |
Lead (Pb), % | 0 | |
0 to 0.010 |
Magnesium (Mg), % | 0 | |
0 to 0.010 |
Manganese (Mn), % | 0 | |
0.6 to 1.2 |
Nickel (Ni), % | 2.6 to 3.4 | |
29 to 31 |
Niobium (Nb), % | 0 | |
0.5 to 1.0 |
Phosphorus (P), % | 0 | |
0 to 0.010 |
Selenium (Se), % | 0 | |
0 to 0.010 |
Silicon (Si), % | 0 | |
0.3 to 0.7 |
Silver (Ag), % | 21.4 to 22.6 | |
0 |
Sulfur (S), % | 0 | |
0 to 0.010 |
Tellurium (Te), % | 0 | |
0 to 0.010 |
Zinc (Zn), % | 0 | |
0 to 0.5 |
Residuals, % | 0 to 0.3 | |
0 |