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ASTM B540 Palladium vs. Solder Alloy 115

Both ASTM B540 palladium and solder alloy 115 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (13, in this case) are not shown.

For each property being compared, the top bar is ASTM B540 palladium and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
28
Elongation at Break, % 1.1 to 14
22
Poisson's Ratio 0.38
0.41
Shear Modulus, GPa 39
10
Tensile Strength: Ultimate (UTS), MPa 830 to 1240
36

Thermal Properties

Latent Heat of Fusion, J/g 140
36
Melting Completion (Liquidus), °C 1220
250
Melting Onset (Solidus), °C 1020
180
Specific Heat Capacity, J/kg-K 240
160
Thermal Expansion, µm/m-K 14
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.9 to 5.5
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 3.5 to 3.9
8.9

Otherwise Unclassified Properties

Density, g/cm3 13
9.9

Common Calculations

Stiffness to Weight: Axial, points 4.7
1.6
Stiffness to Weight: Bending, points 12
10
Strength to Weight: Axial, points 18 to 27
1.0
Strength to Weight: Bending, points 15 to 20
2.4
Thermal Shock Resistance, points 41 to 61
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 13.5 to 14.5
0 to 0.080
Gold (Au), % 9.5 to 10.5
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
63.4 to 65.5
Nickel (Ni), % 0
0 to 0.010
Palladium (Pd), % 34 to 36
0
Platinum (Pt), % 9.5 to 10.5
0
Silver (Ag), % 29 to 31
0 to 0.1
Tin (Sn), % 0
34.5 to 35.5
Zinc (Zn), % 0.8 to 1.2
0 to 0.0010
Residuals, % 0 to 0.3
0