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ASTM B540 Palladium vs. Solder Alloy 301

Both ASTM B540 palladium and solder alloy 301 are otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is ASTM B540 palladium and the bottom bar is solder alloy 301.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
40
Elongation at Break, % 1.1 to 14
51
Poisson's Ratio 0.38
0.34
Shear Modulus, GPa 39
15
Tensile Strength: Ultimate (UTS), MPa 830 to 1240
55
Tensile Strength: Yield (Proof), MPa 620 to 1000
49

Thermal Properties

Latent Heat of Fusion, J/g 140
55
Melting Completion (Liquidus), °C 1220
140
Melting Onset (Solidus), °C 1020
140
Specific Heat Capacity, J/kg-K 240
160
Thermal Expansion, µm/m-K 14
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.9 to 5.5
4.7
Electrical Conductivity: Equal Weight (Specific), % IACS 3.5 to 3.9
4.9

Otherwise Unclassified Properties

Density, g/cm3 13
8.7

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 13 to 100
27
Resilience: Unit (Modulus of Resilience), kJ/m3 1790 to 4660
30
Stiffness to Weight: Axial, points 4.7
2.5
Stiffness to Weight: Bending, points 12
13
Strength to Weight: Axial, points 18 to 27
1.8
Strength to Weight: Bending, points 15 to 20
3.7
Thermal Shock Resistance, points 41 to 61
7.2

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
56.5 to 59
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 13.5 to 14.5
0 to 0.050
Gold (Au), % 9.5 to 10.5
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Palladium (Pd), % 34 to 36
0
Platinum (Pt), % 9.5 to 10.5
0
Silver (Ag), % 29 to 31
0 to 0.1
Tin (Sn), % 0
41 to 43
Zinc (Zn), % 0.8 to 1.2
0 to 0.0010
Residuals, % 0 to 0.3
0