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ASTM B540 Palladium vs. Solder Alloy 801

Both ASTM B540 palladium and solder alloy 801 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (12, in this case) are not shown.

For each property being compared, the top bar is ASTM B540 palladium and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
53
Elongation at Break, % 1.1 to 14
33
Poisson's Ratio 0.38
0.35
Shear Modulus, GPa 39
20
Tensile Strength: Ultimate (UTS), MPa 830 to 1240
55

Thermal Properties

Latent Heat of Fusion, J/g 140
64
Melting Completion (Liquidus), °C 1220
200
Melting Onset (Solidus), °C 1020
200
Specific Heat Capacity, J/kg-K 240
240
Thermal Expansion, µm/m-K 14
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.9 to 5.5
15
Electrical Conductivity: Equal Weight (Specific), % IACS 3.5 to 3.9
19

Otherwise Unclassified Properties

Density, g/cm3 13
7.2

Common Calculations

Stiffness to Weight: Axial, points 4.7
4.1
Stiffness to Weight: Bending, points 12
17
Strength to Weight: Axial, points 18 to 27
2.1
Strength to Weight: Bending, points 15 to 20
4.4
Thermal Shock Resistance, points 41 to 61
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 13.5 to 14.5
0 to 0.050
Gold (Au), % 9.5 to 10.5
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Palladium (Pd), % 34 to 36
0
Platinum (Pt), % 9.5 to 10.5
0
Silver (Ag), % 29 to 31
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0.8 to 1.2
8.5 to 9.5
Residuals, % 0 to 0.3
0