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ASTM B563 Pd-Ag-Cu vs. Solder Alloy 115

Both ASTM B563 Pd-Ag-Cu and solder alloy 115 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is ASTM B563 Pd-Ag-Cu and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
28
Elongation at Break, % 7.0 to 17
22
Poisson's Ratio 0.37
0.41
Shear Modulus, GPa 37
10
Tensile Strength: Ultimate (UTS), MPa 760 to 1170
36

Thermal Properties

Latent Heat of Fusion, J/g 150
36
Melting Completion (Liquidus), °C 1180
250
Melting Onset (Solidus), °C 1030
180
Specific Heat Capacity, J/kg-K 260
160
Thermal Expansion, µm/m-K 14
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.6 to 6.7
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 4.6 to 5.5
8.9

Otherwise Unclassified Properties

Density, g/cm3 11
9.9

Common Calculations

Stiffness to Weight: Axial, points 5.2
1.6
Stiffness to Weight: Bending, points 14
10
Strength to Weight: Axial, points 19 to 30
1.0
Strength to Weight: Bending, points 17 to 22
2.4
Thermal Shock Resistance, points 39 to 61
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 15.5 to 16.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
63.4 to 65.5
Nickel (Ni), % 0.8 to 1.2
0 to 0.010
Palladium (Pd), % 43 to 45
0
Platinum (Pt), % 0.8 to 1.2
0
Silver (Ag), % 37 to 39
0 to 0.1
Tin (Sn), % 0
34.5 to 35.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.4
0