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ASTM B596 Au-Cu vs. CC383H Copper-nickel

ASTM B596 Au-Cu belongs to the otherwise unclassified metals classification, while CC383H copper-nickel belongs to the copper alloys. There are 18 material properties with values for both materials. Properties with values for just one material (12, in this case) are not shown. Please note that the two materials have significantly dissimilar densities. This means that additional care is required when interpreting the data, because some material properties are based on units of mass, while others are based on units of area or volume.

For each property being compared, the top bar is ASTM B596 Au-Cu and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
140
Elongation at Break, % 4.3 to 17
20
Poisson's Ratio 0.41
0.33
Shear Modulus, GPa 36
52
Tensile Strength: Ultimate (UTS), MPa 450 to 620
490

Thermal Properties

Latent Heat of Fusion, J/g 77
240
Melting Completion (Liquidus), °C 1060
1180
Melting Onset (Solidus), °C 930
1130
Specific Heat Capacity, J/kg-K 150
410
Thermal Expansion, µm/m-K 14
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 6.7
5.3

Otherwise Unclassified Properties

Density, g/cm3 18
8.9

Common Calculations

Stiffness to Weight: Axial, points 3.1
8.6
Stiffness to Weight: Bending, points 8.5
19
Strength to Weight: Axial, points 6.8 to 9.4
15
Strength to Weight: Bending, points 7.1 to 8.8
16
Thermal Shock Resistance, points 22 to 30
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 9.0 to 11
64 to 69.1
Gold (Au), % 89 to 91
0
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 0.5
Residuals, % 0 to 0.4
0