ASTM B596 Au-Cu vs. Solder Alloy 113
Both ASTM B596 Au-Cu and solder alloy 113 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.
For each property being compared, the top bar is ASTM B596 Au-Cu and the bottom bar is solder alloy 113.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 100 | |
32 |
Elongation at Break, % | 4.3 to 17 | |
32 |
Poisson's Ratio | 0.41 | |
0.4 |
Shear Modulus, GPa | 36 | |
11 |
Tensile Strength: Ultimate (UTS), MPa | 450 to 620 | |
39 |
Thermal Properties
Latent Heat of Fusion, J/g | 77 | |
40 |
Melting Completion (Liquidus), °C | 1060 | |
230 |
Melting Onset (Solidus), °C | 930 | |
180 |
Specific Heat Capacity, J/kg-K | 150 | |
170 |
Thermal Expansion, µm/m-K | 14 | |
26 |
Electrical Properties
Electrical Conductivity: Equal Volume, % IACS | 14 | |
10 |
Electrical Conductivity: Equal Weight (Specific), % IACS | 6.7 | |
9.8 |
Otherwise Unclassified Properties
Density, g/cm3 | 18 | |
9.5 |
Common Calculations
Stiffness to Weight: Axial, points | 3.1 | |
1.8 |
Stiffness to Weight: Bending, points | 8.5 | |
11 |
Strength to Weight: Axial, points | 6.8 to 9.4 | |
1.1 |
Strength to Weight: Bending, points | 7.1 to 8.8 | |
2.7 |
Thermal Shock Resistance, points | 22 to 30 | |
3.4 |
Alloy Composition
Aluminum (Al), % | 0 | |
0 to 0.0010 |
Antimony (Sb), % | 0 | |
0 to 0.5 |
Arsenic (As), % | 0 | |
0 to 0.030 |
Bismuth (Bi), % | 0 | |
0 to 0.25 |
Cadmium (Cd), % | 0 | |
0 to 0.0050 |
Copper (Cu), % | 9.0 to 11 | |
0 to 0.080 |
Gold (Au), % | 89 to 91 | |
0 to 0.050 |
Indium (In), % | 0 | |
0 to 0.1 |
Iron (Fe), % | 0 | |
0 to 0.020 |
Lead (Pb), % | 0 | |
53.4 to 55.5 |
Nickel (Ni), % | 0 | |
0 to 0.010 |
Silver (Ag), % | 0 | |
0 to 0.1 |
Tin (Sn), % | 0 | |
44.5 to 45.5 |
Zinc (Zn), % | 0 | |
0 to 0.0010 |
Residuals, % | 0 to 0.4 | |
0 |