ASTM B685 Alloy vs. Solder Alloy 801
Both ASTM B685 alloy and solder alloy 801 are otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.
For each property being compared, the top bar is ASTM B685 alloy and the bottom bar is solder alloy 801.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 120 | |
53 |
Poisson's Ratio | 0.37 | |
0.35 |
Shear Modulus, GPa | 43 | |
20 |
Tensile Strength: Ultimate (UTS), MPa | 660 to 1060 | |
55 |
Thermal Properties
Latent Heat of Fusion, J/g | 180 | |
64 |
Melting Completion (Liquidus), °C | 1230 | |
200 |
Melting Onset (Solidus), °C | 1200 | |
200 |
Specific Heat Capacity, J/kg-K | 300 | |
240 |
Thermal Expansion, µm/m-K | 14 | |
22 |
Electrical Properties
Electrical Conductivity: Equal Volume, % IACS | 5.0 | |
15 |
Electrical Conductivity: Equal Weight (Specific), % IACS | 4.1 | |
19 |
Otherwise Unclassified Properties
Density, g/cm3 | 11 | |
7.2 |
Common Calculations
Stiffness to Weight: Axial, points | 6.1 | |
4.1 |
Stiffness to Weight: Bending, points | 15 | |
17 |
Strength to Weight: Axial, points | 17 to 27 | |
2.1 |
Strength to Weight: Bending, points | 16 to 21 | |
4.4 |
Thermal Shock Resistance, points | 28 to 46 | |
3.3 |
Alloy Composition
Aluminum (Al), % | 0 to 0.0050 | |
0 to 0.0010 |
Antimony (Sb), % | 0 | |
0 to 0.1 |
Arsenic (As), % | 0 | |
0 to 0.030 |
Bismuth (Bi), % | 0 | |
0 to 0.1 |
Cadmium (Cd), % | 0 to 0.050 | |
0 to 0.0020 |
Copper (Cu), % | 39.5 to 40.5 | |
0 to 0.050 |
Gold (Au), % | 0 | |
0 to 0.050 |
Indium (In), % | 0 | |
0 to 0.1 |
Iron (Fe), % | 0 to 0.050 | |
0 to 0.020 |
Lead (Pb), % | 0 to 0.030 | |
0 to 0.070 |
Nickel (Ni), % | 0 | |
0 to 0.010 |
Palladium (Pd), % | 59 to 60.5 | |
0 |
Silver (Ag), % | 0 to 0.1 | |
0 to 0.1 |
Tin (Sn), % | 0 | |
89.9 to 91.5 |
Zinc (Zn), % | 0 to 0.060 | |
8.5 to 9.5 |
Residuals, % | 0 to 0.2 | |
0 |