ASTM B817 Type II vs. Solder Alloy 115
ASTM B817 type II belongs to the titanium alloys classification, while solder alloy 115 belongs to the otherwise unclassified metals. There are 20 material properties with values for both materials. Properties with values for just one material (11, in this case) are not shown. Please note that the two materials have significantly dissimilar densities. This means that additional care is required when interpreting the data, because some material properties are based on units of mass, while others are based on units of area or volume.
For each property being compared, the top bar is ASTM B817 type II and the bottom bar is solder alloy 115.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 100 | |
| 28 |
| Elongation at Break, % | 3.0 to 13 | |
| 22 |
| Poisson's Ratio | 0.32 | |
| 0.41 |
| Shear Modulus, GPa | 40 | |
| 10 |
| Tensile Strength: Ultimate (UTS), MPa | 900 to 960 | |
| 36 |
Thermal Properties
| Latent Heat of Fusion, J/g | 400 | |
| 36 |
| Melting Completion (Liquidus), °C | 1580 | |
| 250 |
| Melting Onset (Solidus), °C | 1530 | |
| 180 |
| Specific Heat Capacity, J/kg-K | 550 | |
| 160 |
| Thermal Expansion, µm/m-K | 9.9 | |
| 27 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 37 | |
| 95 |
| Density, g/cm3 | 4.6 | |
| 9.9 |
| Embodied Carbon, kg CO2/kg material | 40 | |
| 7.8 |
| Embodied Energy, MJ/kg | 650 | |
| 130 |
| Embodied Water, L/kg | 220 | |
| 730 |
Common Calculations
| Stiffness to Weight: Axial, points | 13 | |
| 1.6 |
| Stiffness to Weight: Bending, points | 34 | |
| 10 |
| Strength to Weight: Axial, points | 55 to 58 | |
| 1.0 |
| Strength to Weight: Bending, points | 45 to 47 | |
| 2.4 |
| Thermal Shock Resistance, points | 62 to 66 | |
| 3.4 |
Alloy Composition
| Aluminum (Al), % | 5.0 to 6.0 | |
| 0 to 0.0010 |
| Antimony (Sb), % | 0 | |
| 0 to 0.5 |
| Arsenic (As), % | 0 | |
| 0 to 0.030 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.25 |
| Cadmium (Cd), % | 0 | |
| 0 to 0.0050 |
| Carbon (C), % | 0 to 0.1 | |
| 0 |
| Chlorine (Cl), % | 0 to 0.2 | |
| 0 |
| Copper (Cu), % | 0.35 to 1.0 | |
| 0 to 0.080 |
| Gold (Au), % | 0 | |
| 0 to 0.050 |
| Hydrogen (H), % | 0 to 0.015 | |
| 0 |
| Indium (In), % | 0 | |
| 0 to 0.1 |
| Iron (Fe), % | 0.35 to 1.0 | |
| 0 to 0.020 |
| Lead (Pb), % | 0 | |
| 63.4 to 65.5 |
| Nickel (Ni), % | 0 | |
| 0 to 0.010 |
| Nitrogen (N), % | 0 to 0.040 | |
| 0 |
| Oxygen (O), % | 0 to 0.3 | |
| 0 |
| Silicon (Si), % | 0 to 0.1 | |
| 0 |
| Silver (Ag), % | 0 | |
| 0 to 0.1 |
| Sodium (Na), % | 0 to 0.2 | |
| 0 |
| Tin (Sn), % | 1.5 to 2.5 | |
| 34.5 to 35.5 |
| Titanium (Ti), % | 82.1 to 87.8 | |
| 0 |
| Vanadium (V), % | 5.0 to 6.0 | |
| 0 |
| Zinc (Zn), % | 0 | |
| 0 to 0.0010 |
| Residuals, % | 0 to 0.4 | |
| 0 |