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ASTM Grade HC Steel vs. C19500 Copper

ASTM grade HC steel belongs to the iron alloys classification, while C19500 copper belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is ASTM grade HC steel and the bottom bar is C19500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
120
Elongation at Break, % 6.0
2.3 to 38
Poisson's Ratio 0.27
0.34
Shear Modulus, GPa 80
44
Tensile Strength: Ultimate (UTS), MPa 430
380 to 640
Tensile Strength: Yield (Proof), MPa 200
120 to 600

Thermal Properties

Latent Heat of Fusion, J/g 310
210
Maximum Temperature: Mechanical, °C 1100
200
Melting Completion (Liquidus), °C 1410
1090
Melting Onset (Solidus), °C 1370
1090
Specific Heat Capacity, J/kg-K 490
390
Thermal Conductivity, W/m-K 17
200
Thermal Expansion, µm/m-K 11
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.2
50 to 56
Electrical Conductivity: Equal Weight (Specific), % IACS 2.6
50 to 57

Otherwise Unclassified Properties

Base Metal Price, % relative 14
31
Density, g/cm3 7.6
8.9
Embodied Carbon, kg CO2/kg material 2.8
2.7
Embodied Energy, MJ/kg 40
42
Embodied Water, L/kg 170
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 21
14 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 95
59 to 1530
Stiffness to Weight: Axial, points 15
7.3
Stiffness to Weight: Bending, points 26
18
Strength to Weight: Axial, points 16
12 to 20
Strength to Weight: Bending, points 16
13 to 18
Thermal Diffusivity, mm2/s 4.5
58
Thermal Shock Resistance, points 14
13 to 23

Alloy Composition

Aluminum (Al), % 0
0 to 0.020
Carbon (C), % 0 to 0.5
0
Chromium (Cr), % 26 to 30
0
Cobalt (Co), % 0
0.3 to 1.3
Copper (Cu), % 0
94.9 to 98.6
Iron (Fe), % 61.9 to 74
1.0 to 2.0
Lead (Pb), % 0
0 to 0.020
Manganese (Mn), % 0 to 1.0
0
Molybdenum (Mo), % 0 to 0.5
0
Nickel (Ni), % 0 to 4.0
0
Phosphorus (P), % 0 to 0.040
0.010 to 0.35
Silicon (Si), % 0 to 2.0
0
Sulfur (S), % 0 to 0.040
0
Tin (Sn), % 0
0.1 to 1.0
Zinc (Zn), % 0
0 to 0.2
Residuals, % 0
0 to 0.2