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ASTM Grade HI Steel vs. C17500 Copper

ASTM grade HI steel belongs to the iron alloys classification, while C17500 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is ASTM grade HI steel and the bottom bar is C17500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
120
Elongation at Break, % 11
6.0 to 30
Fatigue Strength, MPa 150
170 to 310
Poisson's Ratio 0.27
0.34
Shear Modulus, GPa 79
45
Tensile Strength: Ultimate (UTS), MPa 550
310 to 860
Tensile Strength: Yield (Proof), MPa 270
170 to 760

Thermal Properties

Latent Heat of Fusion, J/g 310
220
Maximum Temperature: Mechanical, °C 1100
220
Melting Completion (Liquidus), °C 1400
1060
Melting Onset (Solidus), °C 1350
1020
Specific Heat Capacity, J/kg-K 490
390
Thermal Conductivity, W/m-K 15
200
Thermal Expansion, µm/m-K 17
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.1
24 to 53
Electrical Conductivity: Equal Weight (Specific), % IACS 2.4
24 to 54

Otherwise Unclassified Properties

Base Metal Price, % relative 23
60
Density, g/cm3 7.8
8.9
Embodied Carbon, kg CO2/kg material 4.1
4.7
Embodied Energy, MJ/kg 59
73
Embodied Water, L/kg 200
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 52
30 to 120
Resilience: Unit (Modulus of Resilience), kJ/m3 180
120 to 2390
Stiffness to Weight: Axial, points 14
7.5
Stiffness to Weight: Bending, points 25
18
Strength to Weight: Axial, points 20
9.7 to 27
Strength to Weight: Bending, points 19
11 to 23
Thermal Diffusivity, mm2/s 3.9
59
Thermal Shock Resistance, points 12
11 to 29

Alloy Composition

Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
0.4 to 0.7
Carbon (C), % 0.2 to 0.5
0
Chromium (Cr), % 26 to 30
0
Cobalt (Co), % 0
2.4 to 2.7
Copper (Cu), % 0
95.6 to 97.2
Iron (Fe), % 46.9 to 59.8
0 to 0.1
Manganese (Mn), % 0 to 2.0
0
Molybdenum (Mo), % 0 to 0.5
0
Nickel (Ni), % 14 to 18
0
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0 to 2.0
0 to 0.2
Sulfur (S), % 0 to 0.040
0
Residuals, % 0
0 to 0.5