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ASTM Grade HK Steel vs. C82500 Copper

ASTM grade HK steel belongs to the iron alloys classification, while C82500 copper belongs to the copper alloys. There are 27 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is ASTM grade HK steel and the bottom bar is C82500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
120
Elongation at Break, % 11
1.0 to 20
Poisson's Ratio 0.27
0.33
Shear Modulus, GPa 79
45
Tensile Strength: Ultimate (UTS), MPa 500
550 to 1100
Tensile Strength: Yield (Proof), MPa 270
310 to 980

Thermal Properties

Latent Heat of Fusion, J/g 310
240
Maximum Temperature: Mechanical, °C 1100
280
Melting Completion (Liquidus), °C 1400
980
Melting Onset (Solidus), °C 1350
860
Specific Heat Capacity, J/kg-K 480
390
Thermal Conductivity, W/m-K 15
130
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.0
20
Electrical Conductivity: Equal Weight (Specific), % IACS 2.3
21

Otherwise Unclassified Properties

Density, g/cm3 7.8
8.8
Embodied Carbon, kg CO2/kg material 4.4
10
Embodied Energy, MJ/kg 63
160
Embodied Water, L/kg 200
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 48
11 to 94
Resilience: Unit (Modulus of Resilience), kJ/m3 190
400 to 4000
Stiffness to Weight: Axial, points 14
7.7
Stiffness to Weight: Bending, points 25
19
Strength to Weight: Axial, points 18
18 to 35
Strength to Weight: Bending, points 18
17 to 27
Thermal Diffusivity, mm2/s 3.9
38
Thermal Shock Resistance, points 11
19 to 38

Alloy Composition

Aluminum (Al), % 0
0 to 0.15
Beryllium (Be), % 0
1.9 to 2.3
Carbon (C), % 0.2 to 0.6
0
Chromium (Cr), % 24 to 28
0 to 0.1
Cobalt (Co), % 0
0.15 to 0.7
Copper (Cu), % 0
95.3 to 97.8
Iron (Fe), % 44.8 to 57.8
0 to 0.25
Lead (Pb), % 0
0 to 0.020
Manganese (Mn), % 0 to 2.0
0
Molybdenum (Mo), % 0 to 0.5
0
Nickel (Ni), % 18 to 22
0 to 0.2
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0 to 2.0
0.2 to 0.35
Sulfur (S), % 0 to 0.040
0
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 0
0 to 0.1
Residuals, % 0
0 to 0.5