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ASTM Grade LC3 Steel vs. C82000 Copper

ASTM grade LC3 steel belongs to the iron alloys classification, while C82000 copper belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is ASTM grade LC3 steel and the bottom bar is C82000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
120
Elongation at Break, % 27
8.0 to 20
Poisson's Ratio 0.29
0.34
Shear Modulus, GPa 73
45
Tensile Strength: Ultimate (UTS), MPa 570
350 to 690
Tensile Strength: Yield (Proof), MPa 310
140 to 520

Thermal Properties

Latent Heat of Fusion, J/g 250
220
Maximum Temperature: Mechanical, °C 410
220
Melting Completion (Liquidus), °C 1460
1090
Melting Onset (Solidus), °C 1420
970
Specific Heat Capacity, J/kg-K 470
390
Thermal Conductivity, W/m-K 52
260
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.6
45
Electrical Conductivity: Equal Weight (Specific), % IACS 8.7
46

Otherwise Unclassified Properties

Base Metal Price, % relative 4.0
60
Density, g/cm3 7.9
8.9
Embodied Carbon, kg CO2/kg material 1.7
5.0
Embodied Energy, MJ/kg 23
77
Embodied Water, L/kg 52
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 130
51 to 55
Resilience: Unit (Modulus of Resilience), kJ/m3 260
80 to 1120
Stiffness to Weight: Axial, points 13
7.5
Stiffness to Weight: Bending, points 24
18
Strength to Weight: Axial, points 20
11 to 22
Strength to Weight: Bending, points 19
12 to 20
Thermal Diffusivity, mm2/s 14
76
Thermal Shock Resistance, points 17
12 to 24

Alloy Composition

Aluminum (Al), % 0
0 to 0.1
Beryllium (Be), % 0
0.45 to 0.8
Carbon (C), % 0 to 0.15
0
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
2.2 to 2.7
Copper (Cu), % 0
95.2 to 97.4
Iron (Fe), % 94.4 to 96.5
0 to 0.1
Lead (Pb), % 0
0 to 0.020
Manganese (Mn), % 0.5 to 0.8
0
Nickel (Ni), % 3.0 to 4.0
0 to 0.2
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0 to 0.6
0 to 0.15
Sulfur (S), % 0 to 0.045
0
Tin (Sn), % 0
0 to 0.1
Zinc (Zn), % 0
0 to 0.1
Residuals, % 0
0 to 0.5