Commercially Pure Palladium vs. Solder Alloy 116
Both commercially pure palladium and solder alloy 116 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.
For each property being compared, the top bar is commercially pure palladium and the bottom bar is solder alloy 116.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 120 | |
26 |
Elongation at Break, % | 1.1 to 11 | |
18 |
Poisson's Ratio | 0.39 | |
0.42 |
Shear Modulus, GPa | 43 | |
9.3 |
Tensile Strength: Ultimate (UTS), MPa | 200 to 380 | |
34 |
Thermal Properties
Latent Heat of Fusion, J/g | 160 | |
34 |
Melting Completion (Liquidus), °C | 1550 | |
260 |
Melting Onset (Solidus), °C | 1550 | |
180 |
Specific Heat Capacity, J/kg-K | 240 | |
160 |
Thermal Expansion, µm/m-K | 12 | |
27 |
Electrical Properties
Electrical Conductivity: Equal Volume, % IACS | 16 | |
9.3 |
Electrical Conductivity: Equal Weight (Specific), % IACS | 12 | |
8.3 |
Otherwise Unclassified Properties
Density, g/cm3 | 12 | |
10 |
Common Calculations
Stiffness to Weight: Axial, points | 5.6 | |
1.5 |
Stiffness to Weight: Bending, points | 14 | |
9.8 |
Strength to Weight: Axial, points | 4.5 to 8.8 | |
0.94 |
Strength to Weight: Bending, points | 6.2 to 9.7 | |
2.3 |
Thermal Shock Resistance, points | 9.8 to 19 | |
3.4 |
Alloy Composition
Aluminum (Al), % | 0 | |
0 to 0.0010 |
Antimony (Sb), % | 0 | |
0 to 0.5 |
Arsenic (As), % | 0 | |
0 to 0.030 |
Bismuth (Bi), % | 0 | |
0 to 0.25 |
Cadmium (Cd), % | 0 | |
0 to 0.0050 |
Copper (Cu), % | 0 | |
0 to 0.080 |
Gold (Au), % | 0 | |
0 to 0.050 |
Indium (In), % | 0 | |
0 to 0.1 |
Iron (Fe), % | 0 | |
0 to 0.020 |
Lead (Pb), % | 0 | |
68.4 to 70.5 |
Nickel (Ni), % | 0 | |
0 to 0.010 |
Palladium (Pd), % | 99.8 to 100 | |
0 |
Silver (Ag), % | 0 | |
0 to 0.1 |
Tin (Sn), % | 0 | |
29.5 to 30.5 |
Zinc (Zn), % | 0 | |
0 to 0.0010 |
Residuals, % | 0 to 0.2 | |
0 |