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Commercially Pure Palladium vs. Solder Alloy 191

Both commercially pure palladium and solder alloy 191 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is commercially pure palladium and the bottom bar is solder alloy 191.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
19
Elongation at Break, % 1.1 to 11
32
Poisson's Ratio 0.39
0.43
Shear Modulus, GPa 43
6.5
Tensile Strength: Ultimate (UTS), MPa 200 to 380
29

Thermal Properties

Latent Heat of Fusion, J/g 160
27
Melting Completion (Liquidus), °C 1550
300
Melting Onset (Solidus), °C 1550
300
Specific Heat Capacity, J/kg-K 240
130
Thermal Expansion, µm/m-K 12
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 16
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 12
7.2

Otherwise Unclassified Properties

Density, g/cm3 12
11

Common Calculations

Stiffness to Weight: Axial, points 5.6
0.93
Stiffness to Weight: Bending, points 14
8.0
Strength to Weight: Axial, points 4.5 to 8.8
0.72
Strength to Weight: Bending, points 6.2 to 9.7
1.9
Thermal Shock Resistance, points 9.8 to 19
3.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 0
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
92.4 to 94
Nickel (Ni), % 0
0 to 0.010
Palladium (Pd), % 99.8 to 100
0
Silver (Ag), % 0
1.2 to 1.8
Tin (Sn), % 0
4.8 to 5.2
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.2
0