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Commercially Pure Palladium vs. Solder Alloy 801

Both commercially pure palladium and solder alloy 801 are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is commercially pure palladium and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
53
Elongation at Break, % 1.1 to 11
33
Poisson's Ratio 0.39
0.35
Shear Modulus, GPa 43
20
Tensile Strength: Ultimate (UTS), MPa 200 to 380
55

Thermal Properties

Latent Heat of Fusion, J/g 160
64
Melting Completion (Liquidus), °C 1550
200
Melting Onset (Solidus), °C 1550
200
Specific Heat Capacity, J/kg-K 240
240
Thermal Expansion, µm/m-K 12
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 16
15
Electrical Conductivity: Equal Weight (Specific), % IACS 12
19

Otherwise Unclassified Properties

Density, g/cm3 12
7.2

Common Calculations

Stiffness to Weight: Axial, points 5.6
4.1
Stiffness to Weight: Bending, points 14
17
Strength to Weight: Axial, points 4.5 to 8.8
2.1
Strength to Weight: Bending, points 6.2 to 9.7
4.4
Thermal Shock Resistance, points 9.8 to 19
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 0
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Palladium (Pd), % 99.8 to 100
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0
8.5 to 9.5
Residuals, % 0 to 0.2
0