Commercially Pure Palladium vs. Nickel 242
Commercially pure palladium belongs to the otherwise unclassified metals classification, while nickel 242 belongs to the nickel alloys. There are 19 material properties with values for both materials. Properties with values for just one material (12, in this case) are not shown.
For each property being compared, the top bar is commercially pure palladium and the bottom bar is nickel 242.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 120 | |
| 220 |
| Elongation at Break, % | 1.1 to 11 | |
| 45 |
| Poisson's Ratio | 0.39 | |
| 0.3 |
| Shear Modulus, GPa | 43 | |
| 84 |
| Shear Strength, MPa | 120 to 200 | |
| 570 |
| Tensile Strength: Ultimate (UTS), MPa | 200 to 380 | |
| 820 |
Thermal Properties
| Latent Heat of Fusion, J/g | 160 | |
| 330 |
| Melting Completion (Liquidus), °C | 1550 | |
| 1380 |
| Melting Onset (Solidus), °C | 1550 | |
| 1290 |
| Specific Heat Capacity, J/kg-K | 240 | |
| 400 |
| Thermal Expansion, µm/m-K | 12 | |
| 11 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 16 | |
| 1.4 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 12 | |
| 1.4 |
Otherwise Unclassified Properties
| Density, g/cm3 | 12 | |
| 9.0 |
Common Calculations
| Stiffness to Weight: Axial, points | 5.6 | |
| 13 |
| Stiffness to Weight: Bending, points | 14 | |
| 22 |
| Strength to Weight: Axial, points | 4.5 to 8.8 | |
| 25 |
| Strength to Weight: Bending, points | 6.2 to 9.7 | |
| 21 |
| Thermal Shock Resistance, points | 9.8 to 19 | |
| 25 |
Alloy Composition
| Aluminum (Al), % | 0 | |
| 0 to 0.5 |
| Boron (B), % | 0 | |
| 0 to 0.0060 |
| Carbon (C), % | 0 | |
| 0 to 0.030 |
| Chromium (Cr), % | 0 | |
| 7.0 to 9.0 |
| Cobalt (Co), % | 0 | |
| 0 to 1.0 |
| Copper (Cu), % | 0 | |
| 0 to 0.5 |
| Iron (Fe), % | 0 | |
| 0 to 2.0 |
| Manganese (Mn), % | 0 | |
| 0 to 0.8 |
| Molybdenum (Mo), % | 0 | |
| 24 to 26 |
| Nickel (Ni), % | 0 | |
| 59.3 to 69 |
| Palladium (Pd), % | 99.8 to 100 | |
| 0 |
| Phosphorus (P), % | 0 | |
| 0 to 0.030 |
| Silicon (Si), % | 0 | |
| 0 to 0.8 |
| Sulfur (S), % | 0 | |
| 0 to 0.015 |
| Residuals, % | 0 to 0.2 | |
| 0 |