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EN 1.1191 Steel vs. C70700 Copper-nickel

EN 1.1191 steel belongs to the iron alloys classification, while C70700 copper-nickel belongs to the copper alloys. There are 30 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is EN 1.1191 steel and the bottom bar is C70700 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 180 to 200
73
Elastic (Young's, Tensile) Modulus, GPa 190
120
Elongation at Break, % 16 to 17
39
Poisson's Ratio 0.29
0.34
Shear Modulus, GPa 72
46
Shear Strength, MPa 380 to 430
220
Tensile Strength: Ultimate (UTS), MPa 630 to 700
320
Tensile Strength: Yield (Proof), MPa 310 to 440
110

Thermal Properties

Latent Heat of Fusion, J/g 250
220
Maximum Temperature: Mechanical, °C 400
220
Melting Completion (Liquidus), °C 1460
1120
Melting Onset (Solidus), °C 1420
1060
Specific Heat Capacity, J/kg-K 470
390
Thermal Conductivity, W/m-K 48
59
Thermal Expansion, µm/m-K 12
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.2
11
Electrical Conductivity: Equal Weight (Specific), % IACS 8.3
12

Otherwise Unclassified Properties

Base Metal Price, % relative 2.1
34
Density, g/cm3 7.8
8.9
Embodied Carbon, kg CO2/kg material 1.4
3.4
Embodied Energy, MJ/kg 19
52
Embodied Water, L/kg 47
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 83 to 100
100
Resilience: Unit (Modulus of Resilience), kJ/m3 260 to 510
51
Stiffness to Weight: Axial, points 13
7.6
Stiffness to Weight: Bending, points 24
19
Strength to Weight: Axial, points 22 to 25
10
Strength to Weight: Bending, points 21 to 22
12
Thermal Diffusivity, mm2/s 13
17
Thermal Shock Resistance, points 20 to 22
12

Alloy Composition

Carbon (C), % 0.42 to 0.5
0
Chromium (Cr), % 0 to 0.4
0
Copper (Cu), % 0
88.5 to 90.5
Iron (Fe), % 97.3 to 99.08
0 to 0.050
Manganese (Mn), % 0.5 to 0.8
0 to 0.5
Molybdenum (Mo), % 0 to 0.1
0
Nickel (Ni), % 0 to 0.4
9.5 to 10.5
Phosphorus (P), % 0 to 0.035
0
Silicon (Si), % 0 to 0.4
0
Sulfur (S), % 0 to 0.035
0
Residuals, % 0
0 to 0.5