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CC381H Copper-nickel vs. Solder Alloy 191

CC381H copper-nickel belongs to the copper alloys classification, while solder alloy 191 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is CC381H copper-nickel and the bottom bar is solder alloy 191.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
19
Elongation at Break, % 20
32
Poisson's Ratio 0.33
0.43
Shear Modulus, GPa 52
6.5
Tensile Strength: Ultimate (UTS), MPa 380
29

Thermal Properties

Latent Heat of Fusion, J/g 240
27
Melting Completion (Liquidus), °C 1180
300
Melting Onset (Solidus), °C 1120
300
Specific Heat Capacity, J/kg-K 410
130
Thermal Conductivity, W/m-K 30
24
Thermal Expansion, µm/m-K 16
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.8
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 6.9
7.2

Otherwise Unclassified Properties

Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 5.0
5.8
Embodied Energy, MJ/kg 73
95

Common Calculations

Stiffness to Weight: Axial, points 8.6
0.93
Stiffness to Weight: Bending, points 19
8.0
Strength to Weight: Axial, points 12
0.72
Strength to Weight: Bending, points 13
1.9
Thermal Diffusivity, mm2/s 8.4
16
Thermal Shock Resistance, points 13
3.9

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64.5 to 69.9
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.5 to 1.5
0 to 0.020
Lead (Pb), % 0 to 0.030
92.4 to 94
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0 to 0.010
Phosphorus (P), % 0 to 0.010
0
Silicon (Si), % 0 to 0.1
0
Silver (Ag), % 0
1.2 to 1.8
Sulfur (S), % 0 to 0.010
0
Tin (Sn), % 0
4.8 to 5.2
Zinc (Zn), % 0 to 0.5
0 to 0.0010