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CC381H Copper-nickel vs. C85200 Brass

Both CC381H copper-nickel and C85200 brass are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 68% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is CC381H copper-nickel and the bottom bar is C85200 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
28
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 52
40
Tensile Strength: Ultimate (UTS), MPa 380
270
Tensile Strength: Yield (Proof), MPa 140
95

Thermal Properties

Latent Heat of Fusion, J/g 240
180
Maximum Temperature: Mechanical, °C 260
140
Melting Completion (Liquidus), °C 1180
940
Melting Onset (Solidus), °C 1120
930
Specific Heat Capacity, J/kg-K 410
380
Thermal Conductivity, W/m-K 30
84
Thermal Expansion, µm/m-K 16
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.8
18
Electrical Conductivity: Equal Weight (Specific), % IACS 6.9
19

Otherwise Unclassified Properties

Base Metal Price, % relative 40
26
Density, g/cm3 8.9
8.4
Embodied Carbon, kg CO2/kg material 5.0
2.8
Embodied Energy, MJ/kg 73
46
Embodied Water, L/kg 280
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 60
59
Resilience: Unit (Modulus of Resilience), kJ/m3 68
42
Stiffness to Weight: Axial, points 8.6
7.0
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 12
8.9
Strength to Weight: Bending, points 13
11
Thermal Diffusivity, mm2/s 8.4
27
Thermal Shock Resistance, points 13
9.3

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.0050
Antimony (Sb), % 0
0 to 0.2
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64.5 to 69.9
70 to 74
Iron (Fe), % 0.5 to 1.5
0 to 0.6
Lead (Pb), % 0 to 0.030
1.5 to 3.8
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0 to 1.0
Phosphorus (P), % 0 to 0.010
0 to 0.020
Silicon (Si), % 0 to 0.1
0 to 0.050
Sulfur (S), % 0 to 0.010
0 to 0.050
Tin (Sn), % 0
0.7 to 2.0
Zinc (Zn), % 0 to 0.5
20 to 27
Residuals, % 0
0 to 0.9