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CC381H Copper-nickel vs. C87900 Brass

Both CC381H copper-nickel and C87900 brass are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is CC381H copper-nickel and the bottom bar is C87900 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
25
Poisson's Ratio 0.33
0.31
Shear Modulus, GPa 52
41
Tensile Strength: Ultimate (UTS), MPa 380
480
Tensile Strength: Yield (Proof), MPa 140
240

Thermal Properties

Latent Heat of Fusion, J/g 240
190
Maximum Temperature: Mechanical, °C 260
130
Melting Completion (Liquidus), °C 1180
930
Melting Onset (Solidus), °C 1120
900
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 30
120
Thermal Expansion, µm/m-K 16
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.8
15
Electrical Conductivity: Equal Weight (Specific), % IACS 6.9
17

Otherwise Unclassified Properties

Base Metal Price, % relative 40
24
Density, g/cm3 8.9
8.1
Embodied Carbon, kg CO2/kg material 5.0
2.7
Embodied Energy, MJ/kg 73
46
Embodied Water, L/kg 280
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 60
100
Resilience: Unit (Modulus of Resilience), kJ/m3 68
270
Stiffness to Weight: Axial, points 8.6
7.3
Stiffness to Weight: Bending, points 19
20
Strength to Weight: Axial, points 12
17
Strength to Weight: Bending, points 13
17
Thermal Diffusivity, mm2/s 8.4
37
Thermal Shock Resistance, points 13
16

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.15
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.050
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64.5 to 69.9
63 to 69.2
Iron (Fe), % 0.5 to 1.5
0 to 0.4
Lead (Pb), % 0 to 0.030
0 to 0.25
Manganese (Mn), % 0.6 to 1.2
0 to 0.15
Nickel (Ni), % 29 to 31
0 to 0.5
Phosphorus (P), % 0 to 0.010
0 to 0.010
Silicon (Si), % 0 to 0.1
0.8 to 1.2
Sulfur (S), % 0 to 0.010
0 to 0.050
Tin (Sn), % 0
0 to 0.25
Zinc (Zn), % 0 to 0.5
30 to 36