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CC382H Copper-nickel vs. CC761S Brass

Both CC382H copper-nickel and CC761S brass are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 67% of their average alloy composition in common.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is CC761S brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
150
Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
8.7
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 53
42
Tensile Strength: Ultimate (UTS), MPa 490
540
Tensile Strength: Yield (Proof), MPa 290
340

Thermal Properties

Latent Heat of Fusion, J/g 240
260
Maximum Temperature: Mechanical, °C 260
170
Melting Completion (Liquidus), °C 1180
960
Melting Onset (Solidus), °C 1120
910
Specific Heat Capacity, J/kg-K 410
410
Thermal Conductivity, W/m-K 30
27
Thermal Expansion, µm/m-K 15
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
40
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
43

Otherwise Unclassified Properties

Base Metal Price, % relative 41
27
Density, g/cm3 8.9
8.3
Embodied Carbon, kg CO2/kg material 5.2
2.7
Embodied Energy, MJ/kg 76
45
Embodied Water, L/kg 290
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
41
Resilience: Unit (Modulus of Resilience), kJ/m3 290
530
Stiffness to Weight: Axial, points 8.8
7.4
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 15
18
Strength to Weight: Bending, points 16
18
Thermal Diffusivity, mm2/s 8.2
8.0
Thermal Shock Resistance, points 16
19

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.1
Antimony (Sb), % 0
0 to 0.050
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
78 to 83
Iron (Fe), % 0.5 to 1.0
0 to 0.6
Lead (Pb), % 0 to 0.0050
0 to 0.8
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0 to 0.2
Nickel (Ni), % 29 to 32
0 to 1.0
Phosphorus (P), % 0 to 0.010
0 to 0.030
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
3.0 to 5.0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Tin (Sn), % 0
0 to 0.3
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
8.9 to 19
Zirconium (Zr), % 0 to 0.15
0