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CC382H Copper-nickel vs. C19100 Copper

Both CC382H copper-nickel and C19100 copper are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C19100 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
120
Elongation at Break, % 20
17 to 37
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 53
43
Tensile Strength: Ultimate (UTS), MPa 490
250 to 630
Tensile Strength: Yield (Proof), MPa 290
75 to 550

Thermal Properties

Latent Heat of Fusion, J/g 240
210
Maximum Temperature: Mechanical, °C 260
200
Melting Completion (Liquidus), °C 1180
1080
Melting Onset (Solidus), °C 1120
1040
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 30
250
Thermal Expansion, µm/m-K 15
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
55
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
56

Otherwise Unclassified Properties

Base Metal Price, % relative 41
33
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.2
2.7
Embodied Energy, MJ/kg 76
43
Embodied Water, L/kg 290
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
60 to 99
Resilience: Unit (Modulus of Resilience), kJ/m3 290
24 to 1310
Stiffness to Weight: Axial, points 8.8
7.2
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 15
7.7 to 20
Strength to Weight: Bending, points 16
9.9 to 18
Thermal Diffusivity, mm2/s 8.2
73
Thermal Shock Resistance, points 16
8.9 to 22

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
96.5 to 98.6
Iron (Fe), % 0.5 to 1.0
0 to 0.2
Lead (Pb), % 0 to 0.0050
0 to 0.1
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
0.9 to 1.3
Phosphorus (P), % 0 to 0.010
0.15 to 0.35
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0.35 to 0.6
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
0 to 0.5
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.5