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CC382H Copper-nickel vs. C19800 Copper

Both CC382H copper-nickel and C19800 copper are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C19800 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
9.0 to 12
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 53
43
Tensile Strength: Ultimate (UTS), MPa 490
430 to 550
Tensile Strength: Yield (Proof), MPa 290
420 to 550

Thermal Properties

Latent Heat of Fusion, J/g 240
210
Maximum Temperature: Mechanical, °C 260
200
Melting Completion (Liquidus), °C 1180
1070
Melting Onset (Solidus), °C 1120
1050
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 30
260
Thermal Expansion, µm/m-K 15
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
61
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
62

Otherwise Unclassified Properties

Base Metal Price, % relative 41
30
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.2
2.8
Embodied Energy, MJ/kg 76
43
Embodied Water, L/kg 290
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
49 to 52
Resilience: Unit (Modulus of Resilience), kJ/m3 290
770 to 1320
Stiffness to Weight: Axial, points 8.8
7.2
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 15
14 to 17
Strength to Weight: Bending, points 16
14 to 17
Thermal Diffusivity, mm2/s 8.2
75
Thermal Shock Resistance, points 16
15 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
95.7 to 99.47
Iron (Fe), % 0.5 to 1.0
0.020 to 0.5
Lead (Pb), % 0 to 0.0050
0
Magnesium (Mg), % 0 to 0.010
0.1 to 1.0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
0
Phosphorus (P), % 0 to 0.010
0.010 to 0.1
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Tin (Sn), % 0
0.1 to 1.0
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
0.3 to 1.5
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.2