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CC382H Copper-nickel vs. C26200 Brass

Both CC382H copper-nickel and C26200 brass are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C26200 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
3.0 to 180
Poisson's Ratio 0.33
0.31
Shear Modulus, GPa 53
41
Tensile Strength: Ultimate (UTS), MPa 490
330 to 770
Tensile Strength: Yield (Proof), MPa 290
110 to 490

Thermal Properties

Latent Heat of Fusion, J/g 240
180
Maximum Temperature: Mechanical, °C 260
140
Melting Completion (Liquidus), °C 1180
950
Melting Onset (Solidus), °C 1120
920
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 30
120
Thermal Expansion, µm/m-K 15
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
28
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
31

Otherwise Unclassified Properties

Base Metal Price, % relative 41
25
Density, g/cm3 8.9
8.2
Embodied Carbon, kg CO2/kg material 5.2
2.7
Embodied Energy, MJ/kg 76
45
Embodied Water, L/kg 290
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
19 to 160
Resilience: Unit (Modulus of Resilience), kJ/m3 290
62 to 1110
Stiffness to Weight: Axial, points 8.8
7.2
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 15
11 to 26
Strength to Weight: Bending, points 16
13 to 23
Thermal Diffusivity, mm2/s 8.2
38
Thermal Shock Resistance, points 16
11 to 26

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
67 to 70
Iron (Fe), % 0.5 to 1.0
0 to 0.050
Lead (Pb), % 0 to 0.0050
0 to 0.070
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
0
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
29.6 to 33
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.3