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CC382H Copper-nickel vs. C55284 Copper

Both CC382H copper-nickel and C55284 copper are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 66% of their average alloy composition in common. There are 18 material properties with values for both materials. Properties with values for just one material (12, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C55284 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
100
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 53
38
Tensile Strength: Ultimate (UTS), MPa 490
180

Thermal Properties

Latent Heat of Fusion, J/g 240
180
Maximum Temperature: Mechanical, °C 260
200
Melting Completion (Liquidus), °C 1180
800
Melting Onset (Solidus), °C 1120
640
Specific Heat Capacity, J/kg-K 410
380
Thermal Expansion, µm/m-K 15
17

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.2
16
Embodied Energy, MJ/kg 76
260

Common Calculations

Stiffness to Weight: Axial, points 8.8
6.5
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 15
5.6
Strength to Weight: Bending, points 16
8.0
Thermal Shock Resistance, points 16
7.4

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
79.2 to 80.7
Iron (Fe), % 0.5 to 1.0
0
Lead (Pb), % 0 to 0.0050
0
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
0
Phosphorus (P), % 0 to 0.010
4.8 to 5.2
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0
Silver (Ag), % 0
14.5 to 15.5
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
0
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.15