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CC382H Copper-nickel vs. C66200 Brass

Both CC382H copper-nickel and C66200 brass are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C66200 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
8.0 to 15
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 53
42
Tensile Strength: Ultimate (UTS), MPa 490
450 to 520
Tensile Strength: Yield (Proof), MPa 290
410 to 480

Thermal Properties

Latent Heat of Fusion, J/g 240
200
Maximum Temperature: Mechanical, °C 260
180
Melting Completion (Liquidus), °C 1180
1070
Melting Onset (Solidus), °C 1120
1030
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 30
150
Thermal Expansion, µm/m-K 15
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
35
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
36

Otherwise Unclassified Properties

Base Metal Price, % relative 41
29
Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 5.2
2.7
Embodied Energy, MJ/kg 76
43
Embodied Water, L/kg 290
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
40 to 66
Resilience: Unit (Modulus of Resilience), kJ/m3 290
760 to 1030
Stiffness to Weight: Axial, points 8.8
7.2
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 15
14 to 17
Strength to Weight: Bending, points 16
15 to 16
Thermal Diffusivity, mm2/s 8.2
45
Thermal Shock Resistance, points 16
16 to 18

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
86.6 to 91
Iron (Fe), % 0.5 to 1.0
0 to 0.050
Lead (Pb), % 0 to 0.0050
0 to 0.050
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
0.3 to 1.0
Phosphorus (P), % 0 to 0.010
0.050 to 0.2
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Tin (Sn), % 0
0.2 to 0.7
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
6.5 to 12.9
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.5