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CC382H Copper-nickel vs. C70260 Copper

Both CC382H copper-nickel and C70260 copper are copper alloys. They have 68% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C70260 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
120
Elongation at Break, % 20
9.5 to 19
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 53
44
Tensile Strength: Ultimate (UTS), MPa 490
520 to 760
Tensile Strength: Yield (Proof), MPa 290
410 to 650

Thermal Properties

Latent Heat of Fusion, J/g 240
220
Maximum Temperature: Mechanical, °C 260
200
Melting Completion (Liquidus), °C 1180
1060
Melting Onset (Solidus), °C 1120
1040
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 30
160
Thermal Expansion, µm/m-K 15
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
40 to 50
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
40 to 51

Otherwise Unclassified Properties

Base Metal Price, % relative 41
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.2
2.7
Embodied Energy, MJ/kg 76
43
Embodied Water, L/kg 290
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
46 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 290
710 to 1810
Stiffness to Weight: Axial, points 8.8
7.3
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 15
16 to 24
Strength to Weight: Bending, points 16
16 to 21
Thermal Diffusivity, mm2/s 8.2
45
Thermal Shock Resistance, points 16
18 to 27

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
95.8 to 98.8
Iron (Fe), % 0.5 to 1.0
0
Lead (Pb), % 0 to 0.0050
0
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
1.0 to 3.0
Phosphorus (P), % 0 to 0.010
0 to 0.010
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0.2 to 0.7
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
0
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.5