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CC382H Copper-nickel vs. C82000 Copper

Both CC382H copper-nickel and C82000 copper are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C82000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
120
Elongation at Break, % 20
8.0 to 20
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 53
45
Tensile Strength: Ultimate (UTS), MPa 490
350 to 690
Tensile Strength: Yield (Proof), MPa 290
140 to 520

Thermal Properties

Latent Heat of Fusion, J/g 240
220
Maximum Temperature: Mechanical, °C 260
220
Melting Completion (Liquidus), °C 1180
1090
Melting Onset (Solidus), °C 1120
970
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 30
260
Thermal Expansion, µm/m-K 15
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
45
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
46

Otherwise Unclassified Properties

Base Metal Price, % relative 41
60
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.2
5.0
Embodied Energy, MJ/kg 76
77
Embodied Water, L/kg 290
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
51 to 55
Resilience: Unit (Modulus of Resilience), kJ/m3 290
80 to 1120
Stiffness to Weight: Axial, points 8.8
7.5
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 15
11 to 22
Strength to Weight: Bending, points 16
12 to 20
Thermal Diffusivity, mm2/s 8.2
76
Thermal Shock Resistance, points 16
12 to 24

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.1
Beryllium (Be), % 0
0.45 to 0.8
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0 to 0.1
Cobalt (Co), % 0
2.2 to 2.7
Copper (Cu), % 62.8 to 68.4
95.2 to 97.4
Iron (Fe), % 0.5 to 1.0
0 to 0.1
Lead (Pb), % 0 to 0.0050
0 to 0.020
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0
Nickel (Ni), % 29 to 32
0 to 0.2
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0 to 0.15
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
0 to 0.1
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 0.5