CC383H Copper-nickel vs. Solder Alloy 811
CC383H copper-nickel belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.
For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is solder alloy 811.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 140 | |
| 52 |
| Elongation at Break, % | 20 | |
| 38 |
| Poisson's Ratio | 0.33 | |
| 0.35 |
| Shear Modulus, GPa | 52 | |
| 19 |
| Tensile Strength: Ultimate (UTS), MPa | 490 | |
| 53 |
Thermal Properties
| Latent Heat of Fusion, J/g | 240 | |
| 63 |
| Melting Completion (Liquidus), °C | 1180 | |
| 200 |
| Melting Onset (Solidus), °C | 1130 | |
| 190 |
| Specific Heat Capacity, J/kg-K | 410 | |
| 230 |
| Thermal Conductivity, W/m-K | 29 | |
| 59 |
| Thermal Expansion, µm/m-K | 15 | |
| 22 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 5.2 | |
| 14 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 5.3 | |
| 17 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.9 | |
| 7.3 |
| Embodied Carbon, kg CO2/kg material | 5.7 | |
| 14 |
| Embodied Energy, MJ/kg | 83 | |
| 240 |
| Embodied Water, L/kg | 280 | |
| 1200 |
Common Calculations
| Stiffness to Weight: Axial, points | 8.6 | |
| 4.0 |
| Stiffness to Weight: Bending, points | 19 | |
| 17 |
| Strength to Weight: Axial, points | 15 | |
| 2.0 |
| Strength to Weight: Bending, points | 16 | |
| 4.3 |
| Thermal Diffusivity, mm2/s | 8.1 | |
| 35 |
| Thermal Shock Resistance, points | 17 | |
| 3.3 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.010 | |
| 0 to 0.0010 |
| Antimony (Sb), % | 0 | |
| 0 to 0.1 |
| Arsenic (As), % | 0 | |
| 0 to 0.030 |
| Bismuth (Bi), % | 0 to 0.010 | |
| 2.8 to 3.2 |
| Boron (B), % | 0 to 0.010 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.020 | |
| 0 to 0.0020 |
| Carbon (C), % | 0 to 0.030 | |
| 0 |
| Copper (Cu), % | 64 to 69.1 | |
| 0 to 0.050 |
| Gold (Au), % | 0 | |
| 0 to 0.050 |
| Indium (In), % | 0 | |
| 0 to 0.1 |
| Iron (Fe), % | 0.5 to 1.5 | |
| 0 to 0.020 |
| Lead (Pb), % | 0 to 0.010 | |
| 0 to 0.070 |
| Magnesium (Mg), % | 0 to 0.010 | |
| 0 |
| Manganese (Mn), % | 0.6 to 1.2 | |
| 0 |
| Nickel (Ni), % | 29 to 31 | |
| 0 to 0.010 |
| Niobium (Nb), % | 0.5 to 1.0 | |
| 0 |
| Phosphorus (P), % | 0 to 0.010 | |
| 0 |
| Selenium (Se), % | 0 to 0.010 | |
| 0 |
| Silicon (Si), % | 0.3 to 0.7 | |
| 0 |
| Silver (Ag), % | 0 | |
| 0 to 0.1 |
| Sulfur (S), % | 0 to 0.010 | |
| 0 |
| Tellurium (Te), % | 0 to 0.010 | |
| 0 |
| Tin (Sn), % | 0 | |
| 87.8 to 89.7 |
| Zinc (Zn), % | 0 to 0.5 | |
| 7.5 to 8.5 |