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CC383H Copper-nickel vs. C55180 Copper

Both CC383H copper-nickel and C55180 copper are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 67% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C55180 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
110
Elongation at Break, % 20
20
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 52
41
Tensile Strength: Ultimate (UTS), MPa 490
200
Tensile Strength: Yield (Proof), MPa 260
100

Thermal Properties

Latent Heat of Fusion, J/g 240
200
Maximum Temperature: Mechanical, °C 260
200
Melting Completion (Liquidus), °C 1180
920
Melting Onset (Solidus), °C 1130
710
Specific Heat Capacity, J/kg-K 410
400
Thermal Conductivity, W/m-K 29
200
Thermal Expansion, µm/m-K 15
17

Otherwise Unclassified Properties

Base Metal Price, % relative 44
29
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 5.7
2.5
Embodied Energy, MJ/kg 83
39
Embodied Water, L/kg 280
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
34
Resilience: Unit (Modulus of Resilience), kJ/m3 250
48
Stiffness to Weight: Axial, points 8.6
7.1
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 15
6.4
Strength to Weight: Bending, points 16
8.8
Thermal Diffusivity, mm2/s 8.1
56
Thermal Shock Resistance, points 17
7.9

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.010
0
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64 to 69.1
94.7 to 95.2
Iron (Fe), % 0.5 to 1.5
0
Lead (Pb), % 0 to 0.010
0
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
4.8 to 5.2
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Zinc (Zn), % 0 to 0.5
0
Residuals, % 0
0 to 0.15