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CC383H Copper-nickel vs. C66900 Brass

Both CC383H copper-nickel and C66900 brass are copper alloys. They have 65% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C66900 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
120
Elongation at Break, % 20
1.1 to 26
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 52
45
Tensile Strength: Ultimate (UTS), MPa 490
460 to 770
Tensile Strength: Yield (Proof), MPa 260
330 to 760

Thermal Properties

Latent Heat of Fusion, J/g 240
190
Maximum Temperature: Mechanical, °C 260
150
Melting Completion (Liquidus), °C 1180
860
Melting Onset (Solidus), °C 1130
850
Specific Heat Capacity, J/kg-K 410
400
Thermal Expansion, µm/m-K 15
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
3.4
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
3.8

Otherwise Unclassified Properties

Base Metal Price, % relative 44
23
Density, g/cm3 8.9
8.2
Embodied Carbon, kg CO2/kg material 5.7
2.8
Embodied Energy, MJ/kg 83
46
Embodied Water, L/kg 280
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
4.6 to 200
Resilience: Unit (Modulus of Resilience), kJ/m3 250
460 to 2450
Stiffness to Weight: Axial, points 8.6
8.1
Stiffness to Weight: Bending, points 19
20
Strength to Weight: Axial, points 15
15 to 26
Strength to Weight: Bending, points 16
16 to 23
Thermal Shock Resistance, points 17
14 to 23

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.010
0
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64 to 69.1
62.5 to 64.5
Iron (Fe), % 0.5 to 1.5
0 to 0.25
Lead (Pb), % 0 to 0.010
0 to 0.050
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
11.5 to 12.5
Nickel (Ni), % 29 to 31
0
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Zinc (Zn), % 0 to 0.5
22.5 to 26
Residuals, % 0
0 to 0.2