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CC383H Copper-nickel vs. C85400 Brass

Both CC383H copper-nickel and C85400 brass are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 68% of their average alloy composition in common.

For each property being compared, the top bar is CC383H copper-nickel and the bottom bar is C85400 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
55
Elastic (Young's, Tensile) Modulus, GPa 140
100
Elongation at Break, % 20
23
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 52
40
Tensile Strength: Ultimate (UTS), MPa 490
220
Tensile Strength: Yield (Proof), MPa 260
85

Thermal Properties

Latent Heat of Fusion, J/g 240
180
Maximum Temperature: Mechanical, °C 260
130
Melting Completion (Liquidus), °C 1180
940
Melting Onset (Solidus), °C 1130
940
Specific Heat Capacity, J/kg-K 410
380
Thermal Conductivity, W/m-K 29
89
Thermal Expansion, µm/m-K 15
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.2
20
Electrical Conductivity: Equal Weight (Specific), % IACS 5.3
22

Otherwise Unclassified Properties

Base Metal Price, % relative 44
25
Density, g/cm3 8.9
8.3
Embodied Carbon, kg CO2/kg material 5.7
2.8
Embodied Energy, MJ/kg 83
46
Embodied Water, L/kg 280
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 84
40
Resilience: Unit (Modulus of Resilience), kJ/m3 250
35
Stiffness to Weight: Axial, points 8.6
7.0
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 15
7.5
Strength to Weight: Bending, points 16
9.9
Thermal Diffusivity, mm2/s 8.1
28
Thermal Shock Resistance, points 17
7.6

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.35
Bismuth (Bi), % 0 to 0.010
0
Boron (B), % 0 to 0.010
0
Cadmium (Cd), % 0 to 0.020
0
Carbon (C), % 0 to 0.030
0
Copper (Cu), % 64 to 69.1
65 to 70
Iron (Fe), % 0.5 to 1.5
0 to 0.7
Lead (Pb), % 0 to 0.010
1.5 to 3.8
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.6 to 1.2
0
Nickel (Ni), % 29 to 31
0 to 1.0
Niobium (Nb), % 0.5 to 1.0
0
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.010
0
Silicon (Si), % 0.3 to 0.7
0 to 0.050
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.010
0
Tin (Sn), % 0
0.5 to 1.5
Zinc (Zn), % 0 to 0.5
24 to 32
Residuals, % 0
0 to 1.1