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CC751S Brass vs. C19700 Copper

Both CC751S brass and C19700 copper are copper alloys. They have 65% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is CC751S brass and the bottom bar is C19700 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 5.6
2.4 to 13
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 40
43
Tensile Strength: Ultimate (UTS), MPa 450
400 to 530
Tensile Strength: Yield (Proof), MPa 320
330 to 520

Thermal Properties

Latent Heat of Fusion, J/g 190
210
Maximum Temperature: Mechanical, °C 130
200
Melting Completion (Liquidus), °C 850
1090
Melting Onset (Solidus), °C 810
1040
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 110
250
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 25
86 to 88
Electrical Conductivity: Equal Weight (Specific), % IACS 28
87 to 89

Otherwise Unclassified Properties

Base Metal Price, % relative 24
30
Density, g/cm3 8.1
8.9
Embodied Carbon, kg CO2/kg material 2.8
2.6
Embodied Energy, MJ/kg 46
41
Embodied Water, L/kg 330
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 23
12 to 49
Resilience: Unit (Modulus of Resilience), kJ/m3 480
460 to 1160
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 15
12 to 16
Strength to Weight: Bending, points 16
14 to 16
Thermal Diffusivity, mm2/s 35
73
Thermal Shock Resistance, points 15
14 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.1
0
Antimony (Sb), % 0 to 0.5
0
Cobalt (Co), % 0
0 to 0.050
Copper (Cu), % 62.7 to 66
97.4 to 99.59
Iron (Fe), % 0.25 to 0.5
0.3 to 1.2
Lead (Pb), % 0.8 to 2.2
0 to 0.050
Magnesium (Mg), % 0
0.010 to 0.2
Manganese (Mn), % 0 to 0.15
0 to 0.050
Nickel (Ni), % 0 to 0.8
0 to 0.050
Phosphorus (P), % 0
0.1 to 0.4
Silicon (Si), % 0.65 to 1.1
0
Tin (Sn), % 0 to 0.8
0 to 0.2
Zinc (Zn), % 27.9 to 35.6
0 to 0.2
Residuals, % 0
0 to 0.2