CC755S Brass vs. C77300 Nickel Silver
Both CC755S brass and C77300 nickel silver are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 86% of their average alloy composition in common. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.
For each property being compared, the top bar is CC755S brass and the bottom bar is C77300 nickel silver.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 100 | |
| 110 |
| Poisson's Ratio | 0.31 | |
| 0.3 |
| Shear Modulus, GPa | 40 | |
| 42 |
| Tensile Strength: Ultimate (UTS), MPa | 390 | |
| 540 |
Thermal Properties
| Latent Heat of Fusion, J/g | 170 | |
| 180 |
| Maximum Temperature: Mechanical, °C | 120 | |
| 130 |
| Melting Completion (Liquidus), °C | 820 | |
| 940 |
| Melting Onset (Solidus), °C | 780 | |
| 920 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 390 |
| Thermal Expansion, µm/m-K | 21 | |
| 20 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 27 | |
| 5.5 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 30 | |
| 6.3 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 23 | |
| 26 |
| Density, g/cm3 | 8.1 | |
| 7.9 |
| Embodied Carbon, kg CO2/kg material | 2.7 | |
| 3.5 |
| Embodied Energy, MJ/kg | 46 | |
| 56 |
| Embodied Water, L/kg | 330 | |
| 310 |
Common Calculations
| Stiffness to Weight: Axial, points | 7.1 | |
| 7.7 |
| Stiffness to Weight: Bending, points | 19 | |
| 20 |
| Strength to Weight: Axial, points | 14 | |
| 19 |
| Strength to Weight: Bending, points | 15 | |
| 19 |
| Thermal Shock Resistance, points | 13 | |
| 17 |
Alloy Composition
| Aluminum (Al), % | 0.4 to 0.7 | |
| 0 to 0.010 |
| Copper (Cu), % | 59.5 to 61 | |
| 46 to 50 |
| Iron (Fe), % | 0.050 to 0.2 | |
| 0 |
| Lead (Pb), % | 1.2 to 1.7 | |
| 0 to 0.050 |
| Manganese (Mn), % | 0 to 0.050 | |
| 0 |
| Nickel (Ni), % | 0 to 0.2 | |
| 9.0 to 11 |
| Phosphorus (P), % | 0 | |
| 0 to 0.25 |
| Silicon (Si), % | 0 to 0.050 | |
| 0.040 to 0.25 |
| Tin (Sn), % | 0 to 0.3 | |
| 0 |
| Zinc (Zn), % | 35.8 to 38.9 | |
| 37.9 to 45 |
| Residuals, % | 0 | |
| 0 to 0.5 |