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CC755S Brass vs. C96200 Copper-nickel

Both CC755S brass and C96200 copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 61% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is CC755S brass and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 9.5
23
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 40
46
Tensile Strength: Ultimate (UTS), MPa 390
350
Tensile Strength: Yield (Proof), MPa 250
190

Thermal Properties

Latent Heat of Fusion, J/g 170
220
Maximum Temperature: Mechanical, °C 120
220
Melting Completion (Liquidus), °C 820
1150
Melting Onset (Solidus), °C 780
1100
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 120
45
Thermal Expansion, µm/m-K 21
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 27
11
Electrical Conductivity: Equal Weight (Specific), % IACS 30
11

Otherwise Unclassified Properties

Base Metal Price, % relative 23
36
Density, g/cm3 8.1
8.9
Embodied Carbon, kg CO2/kg material 2.7
3.8
Embodied Energy, MJ/kg 46
58
Embodied Water, L/kg 330
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 33
68
Resilience: Unit (Modulus of Resilience), kJ/m3 290
150
Stiffness to Weight: Axial, points 7.1
7.8
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 14
11
Strength to Weight: Bending, points 15
13
Thermal Diffusivity, mm2/s 38
13
Thermal Shock Resistance, points 13
12

Alloy Composition

Aluminum (Al), % 0.4 to 0.7
0
Carbon (C), % 0
0 to 0.1
Copper (Cu), % 59.5 to 61
83.6 to 90
Iron (Fe), % 0.050 to 0.2
1.0 to 1.8
Lead (Pb), % 1.2 to 1.7
0 to 0.010
Manganese (Mn), % 0 to 0.050
0 to 1.5
Nickel (Ni), % 0 to 0.2
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0 to 0.050
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Tin (Sn), % 0 to 0.3
0
Zinc (Zn), % 35.8 to 38.9
0
Residuals, % 0
0 to 0.5