CR006A Copper vs. Solder Alloy 801
CR006A copper belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.
For each property being compared, the top bar is CR006A copper and the bottom bar is solder alloy 801.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 120 | |
53 |
Elongation at Break, % | 15 | |
33 |
Poisson's Ratio | 0.34 | |
0.35 |
Shear Modulus, GPa | 43 | |
20 |
Tensile Strength: Ultimate (UTS), MPa | 230 | |
55 |
Thermal Properties
Latent Heat of Fusion, J/g | 210 | |
64 |
Melting Completion (Liquidus), °C | 1090 | |
200 |
Melting Onset (Solidus), °C | 1040 | |
200 |
Specific Heat Capacity, J/kg-K | 390 | |
240 |
Thermal Conductivity, W/m-K | 380 | |
61 |
Thermal Expansion, µm/m-K | 17 | |
22 |
Otherwise Unclassified Properties
Density, g/cm3 | 9.0 | |
7.2 |
Embodied Carbon, kg CO2/kg material | 2.6 | |
14 |
Embodied Energy, MJ/kg | 41 | |
240 |
Embodied Water, L/kg | 320 | |
1140 |
Common Calculations
Stiffness to Weight: Axial, points | 7.2 | |
4.1 |
Stiffness to Weight: Bending, points | 18 | |
17 |
Strength to Weight: Axial, points | 7.1 | |
2.1 |
Strength to Weight: Bending, points | 9.3 | |
4.4 |
Thermal Diffusivity, mm2/s | 110 | |
36 |
Thermal Shock Resistance, points | 8.1 | |
3.3 |
Alloy Composition
Aluminum (Al), % | 0 | |
0 to 0.0010 |
Antimony (Sb), % | 0 | |
0 to 0.1 |
Arsenic (As), % | 0 | |
0 to 0.030 |
Bismuth (Bi), % | 0 | |
0 to 0.1 |
Cadmium (Cd), % | 0 | |
0 to 0.0020 |
Copper (Cu), % | 99.9 to 100 | |
0 to 0.050 |
Gold (Au), % | 0 | |
0 to 0.050 |
Indium (In), % | 0 | |
0 to 0.1 |
Iron (Fe), % | 0 | |
0 to 0.020 |
Lead (Pb), % | 0 | |
0 to 0.070 |
Nickel (Ni), % | 0 | |
0 to 0.010 |
Oxygen (O), % | 0 to 0.1 | |
0 |
Silver (Ag), % | 0 to 0.015 | |
0 to 0.1 |
Tin (Sn), % | 0 | |
89.9 to 91.5 |
Zinc (Zn), % | 0 | |
8.5 to 9.5 |