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CR011A Copper vs. EN 2.4665 Nickel

CR011A copper belongs to the copper alloys classification, while EN 2.4665 nickel belongs to the nickel alloys. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is CR011A copper and the bottom bar is EN 2.4665 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
210
Elongation at Break, % 15
34
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
81
Tensile Strength: Ultimate (UTS), MPa 220
790
Tensile Strength: Yield (Proof), MPa 130
300

Thermal Properties

Latent Heat of Fusion, J/g 210
320
Maximum Temperature: Mechanical, °C 200
990
Melting Completion (Liquidus), °C 1090
1460
Melting Onset (Solidus), °C 1040
1410
Specific Heat Capacity, J/kg-K 390
450
Thermal Conductivity, W/m-K 390
12
Thermal Expansion, µm/m-K 17
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
1.5
Electrical Conductivity: Equal Weight (Specific), % IACS 100
1.6

Otherwise Unclassified Properties

Base Metal Price, % relative 32
55
Density, g/cm3 9.0
8.4
Embodied Carbon, kg CO2/kg material 2.6
9.2
Embodied Energy, MJ/kg 42
130
Embodied Water, L/kg 340
270

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 29
210
Resilience: Unit (Modulus of Resilience), kJ/m3 76
220
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
23
Strength to Weight: Axial, points 6.8
26
Strength to Weight: Bending, points 9.0
22
Thermal Diffusivity, mm2/s 110
3.2
Thermal Shock Resistance, points 7.8
20

Alloy Composition

Aluminum (Al), % 0
0 to 0.5
Bismuth (Bi), % 0 to 0.00050
0
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0.050 to 0.15
Chromium (Cr), % 0
20.5 to 23
Cobalt (Co), % 0
0.5 to 2.5
Copper (Cu), % 99.88 to 99.97
0 to 0.5
Iron (Fe), % 0
17 to 20
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
8.0 to 10
Nickel (Ni), % 0
40.3 to 53.8
Oxygen (O), % 0 to 0.040
0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 1.0
Silver (Ag), % 0.030 to 0.050
0
Sulfur (S), % 0
0 to 0.015
Tungsten (W), % 0
0.2 to 1.0