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CR014A Copper vs. C96300 Copper-nickel

Both CR014A copper and C96300 copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 77% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is CR014A copper and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Elongation at Break, % 15
11
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
49
Tensile Strength: Ultimate (UTS), MPa 230
580
Tensile Strength: Yield (Proof), MPa 140
430

Thermal Properties

Latent Heat of Fusion, J/g 210
230
Maximum Temperature: Mechanical, °C 200
240
Melting Completion (Liquidus), °C 1090
1200
Melting Onset (Solidus), °C 1040
1150
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 380
37
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 99
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 32
42
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.1
Embodied Energy, MJ/kg 42
76
Embodied Water, L/kg 340
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 31
59
Resilience: Unit (Modulus of Resilience), kJ/m3 83
720
Stiffness to Weight: Axial, points 7.2
8.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 7.1
18
Strength to Weight: Bending, points 9.3
17
Thermal Diffusivity, mm2/s 110
10
Thermal Shock Resistance, points 8.1
20

Alloy Composition

Bismuth (Bi), % 0 to 0.00050
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 99.913 to 99.969
72.3 to 80.8
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0.25 to 1.5
Nickel (Ni), % 0
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0.0010 to 0.0070
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 0.030 to 0.050
0
Sulfur (S), % 0
0 to 0.020
Residuals, % 0
0 to 0.5