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Grade 38 Titanium vs. C96300 Copper-nickel

Grade 38 titanium belongs to the titanium alloys classification, while C96300 copper-nickel belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is grade 38 titanium and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
130
Elongation at Break, % 11
11
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 40
49
Tensile Strength: Ultimate (UTS), MPa 1000
580
Tensile Strength: Yield (Proof), MPa 910
430

Thermal Properties

Latent Heat of Fusion, J/g 410
230
Maximum Temperature: Mechanical, °C 330
240
Melting Completion (Liquidus), °C 1620
1200
Melting Onset (Solidus), °C 1570
1150
Specific Heat Capacity, J/kg-K 550
400
Thermal Conductivity, W/m-K 8.0
37
Thermal Expansion, µm/m-K 9.3
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.2
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 2.4
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 36
42
Density, g/cm3 4.5
8.9
Embodied Carbon, kg CO2/kg material 35
5.1
Embodied Energy, MJ/kg 560
76
Embodied Water, L/kg 160
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 110
59
Resilience: Unit (Modulus of Resilience), kJ/m3 3840
720
Stiffness to Weight: Axial, points 13
8.2
Stiffness to Weight: Bending, points 35
19
Strength to Weight: Axial, points 62
18
Strength to Weight: Bending, points 49
17
Thermal Diffusivity, mm2/s 3.2
10
Thermal Shock Resistance, points 72
20

Alloy Composition

Aluminum (Al), % 3.5 to 4.5
0
Carbon (C), % 0 to 0.080
0 to 0.15
Copper (Cu), % 0
72.3 to 80.8
Hydrogen (H), % 0 to 0.015
0
Iron (Fe), % 1.2 to 1.8
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0.25 to 1.5
Nickel (Ni), % 0
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Nitrogen (N), % 0 to 0.030
0
Oxygen (O), % 0.2 to 0.3
0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Titanium (Ti), % 89.9 to 93.1
0
Vanadium (V), % 2.0 to 3.0
0
Residuals, % 0
0 to 0.5