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Grade C-2 Titanium vs. Solder Alloy 801

Grade C-2 titanium belongs to the titanium alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is grade C-2 titanium and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 180
22
Elastic (Young's, Tensile) Modulus, GPa 110
53
Elongation at Break, % 17
33
Poisson's Ratio 0.32
0.35
Shear Modulus, GPa 40
20
Tensile Strength: Ultimate (UTS), MPa 390
55

Thermal Properties

Latent Heat of Fusion, J/g 420
64
Melting Completion (Liquidus), °C 1660
200
Melting Onset (Solidus), °C 1610
200
Specific Heat Capacity, J/kg-K 540
240
Thermal Conductivity, W/m-K 21
61
Thermal Expansion, µm/m-K 8.7
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.6
15
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
19

Otherwise Unclassified Properties

Density, g/cm3 4.5
7.2
Embodied Carbon, kg CO2/kg material 31
14
Embodied Energy, MJ/kg 510
240
Embodied Water, L/kg 110
1140

Common Calculations

Stiffness to Weight: Axial, points 13
4.1
Stiffness to Weight: Bending, points 35
17
Strength to Weight: Axial, points 24
2.1
Strength to Weight: Bending, points 26
4.4
Thermal Diffusivity, mm2/s 8.8
36
Thermal Shock Resistance, points 30
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.1
0
Copper (Cu), % 0
0 to 0.050
Gold (Au), % 0
0 to 0.050
Hydrogen (H), % 0 to 0.015
0
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.2
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0 to 0.050
0 to 0.010
Oxygen (O), % 0 to 0.4
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Titanium (Ti), % 98.8 to 100
0
Zinc (Zn), % 0
8.5 to 9.5
Residuals, % 0 to 0.4
0