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Grade M30C Nickel vs. C34200 Brass

Grade M30C nickel belongs to the nickel alloys classification, while C34200 brass belongs to the copper alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is grade M30C nickel and the bottom bar is C34200 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
100
Elongation at Break, % 29
3.0 to 17
Poisson's Ratio 0.32
0.31
Shear Modulus, GPa 61
40
Tensile Strength: Ultimate (UTS), MPa 510
370 to 650
Tensile Strength: Yield (Proof), MPa 250
150 to 420

Thermal Properties

Latent Heat of Fusion, J/g 290
170
Maximum Temperature: Mechanical, °C 900
120
Melting Completion (Liquidus), °C 1290
910
Melting Onset (Solidus), °C 1240
890
Specific Heat Capacity, J/kg-K 430
380
Thermal Conductivity, W/m-K 22
120
Thermal Expansion, µm/m-K 13
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
26
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
29

Otherwise Unclassified Properties

Base Metal Price, % relative 60
24
Density, g/cm3 8.8
8.2
Embodied Carbon, kg CO2/kg material 9.5
2.6
Embodied Energy, MJ/kg 140
45
Embodied Water, L/kg 250
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
9.0 to 98
Resilience: Unit (Modulus of Resilience), kJ/m3 200
110 to 870
Stiffness to Weight: Axial, points 10
7.1
Stiffness to Weight: Bending, points 21
19
Strength to Weight: Axial, points 16
13 to 22
Strength to Weight: Bending, points 16
14 to 20
Thermal Diffusivity, mm2/s 5.7
37
Thermal Shock Resistance, points 18
12 to 22

Alloy Composition

Carbon (C), % 0 to 0.3
0
Copper (Cu), % 26 to 33
62 to 65
Iron (Fe), % 0 to 3.5
0 to 0.1
Lead (Pb), % 0
1.5 to 2.5
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 56.6 to 72
0
Niobium (Nb), % 1.0 to 3.0
0
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 1.0 to 2.0
0
Sulfur (S), % 0 to 0.030
0
Zinc (Zn), % 0
32 to 36.5
Residuals, % 0
0 to 0.4