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Grade M30C Nickel vs. C96200 Copper-nickel

Grade M30C nickel belongs to the nickel alloys classification, while C96200 copper-nickel belongs to the copper alloys. They have 42% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is grade M30C nickel and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
120
Elongation at Break, % 29
23
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 61
46
Tensile Strength: Ultimate (UTS), MPa 510
350
Tensile Strength: Yield (Proof), MPa 250
190

Thermal Properties

Latent Heat of Fusion, J/g 290
220
Maximum Temperature: Mechanical, °C 900
220
Melting Completion (Liquidus), °C 1290
1150
Melting Onset (Solidus), °C 1240
1100
Specific Heat Capacity, J/kg-K 430
390
Thermal Conductivity, W/m-K 22
45
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
11
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
11

Otherwise Unclassified Properties

Base Metal Price, % relative 60
36
Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 9.5
3.8
Embodied Energy, MJ/kg 140
58
Embodied Water, L/kg 250
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
68
Resilience: Unit (Modulus of Resilience), kJ/m3 200
150
Stiffness to Weight: Axial, points 10
7.8
Stiffness to Weight: Bending, points 21
19
Strength to Weight: Axial, points 16
11
Strength to Weight: Bending, points 16
13
Thermal Diffusivity, mm2/s 5.7
13
Thermal Shock Resistance, points 18
12

Alloy Composition

Carbon (C), % 0 to 0.3
0 to 0.1
Copper (Cu), % 26 to 33
83.6 to 90
Iron (Fe), % 0 to 3.5
1.0 to 1.8
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0 to 1.5
0 to 1.5
Nickel (Ni), % 56.6 to 72
9.0 to 11
Niobium (Nb), % 1.0 to 3.0
0 to 1.0
Phosphorus (P), % 0 to 0.030
0 to 0.020
Silicon (Si), % 1.0 to 2.0
0 to 0.5
Sulfur (S), % 0 to 0.030
0 to 0.020
Residuals, % 0
0 to 0.5